Electronics Forum | Fri Jul 09 05:29:58 EDT 1999 | Wolfgang Busko
| Any recommendations for a reballer for BGA and mBGA? Low volume, low cost appreciated! | | Did you ever hear of WPRB1000 system from Weller ? Besides all other aspects of reballing I saw it worked quite simple and suits for low volume and I th
Electronics Forum | Mon Mar 15 09:14:26 EST 1999 | Todd N
Does anyone have any recommendations on spray fluxers? Are there major differences between the high priced ultrasonic machines to the low priced flux/air spraying machines? We are going to be spraying an OA flux with 11% solids content. Are there any
Electronics Forum | Tue Mar 16 13:49:21 EST 1999 | Steve Skinner
| Does anyone have any recommendations on spray fluxers? Are there major differences between the high priced ultrasonic machines to the low priced flux/air spraying machines? We are going to be spraying an OA flux with 11% solids content. Are there a
Electronics Forum | Mon Oct 12 22:35:55 EDT 1998 | Hank Hsiung
Hello, friends: Do you know where I can buy cheap double sided flexible circuits, especially adhesiveless system. Also, when I make double sided flexible circuit assembly, beside using temporary stiffener, any other method to do double sided as
Electronics Forum | Thu Jul 16 14:29:00 EDT 1998 | Aric Parr
Contact me off-line. I inherited 4 of them. I cannot make recommendations in recorded media. However, yield is very good when PM is done properly. | Howdy, | Is anyone using Seho? Need to know more about 7000 series machines with nitrogen and ultraso
Electronics Forum | Mon Mar 11 04:25:49 EST 2002 | wbu
Don�t your recent findings on soldering defects point towards less need for AOI? Besides that, I imagine that with 100% control and having only good prints being processed while the bad ones getting washed and reprint you will see this magical 0%. Sh
Electronics Forum | Tue May 07 22:25:15 EDT 2002 | L_ch
Hello, As you know for the double side assembly PCBs, we normally first place the bottom side, then place top side after reflow soldering of bottom side. are there any other considerations for the sequence of reflow soldering ( bottoms side first, to
Electronics Forum | Thu Jun 24 11:54:36 EDT 2004 | rickw
many solder-ball issues can be resolved by reducing the aperture size, usually 10 to 15% reduction will work. If the aperture size is the same as the pad size paste tends to be squished out under the part, paste off pad under the part will liquify a
Electronics Forum | Mon Sep 20 16:27:58 EDT 2004 | blnorman
Besides the processing tests (different print speeds, print delay times, etc.) one test we've had to use is humidity exposure. Solderballing due to high outside humidity is a problem in our plant. So we expose paste to 85% humidity for various time
Electronics Forum | Wed Sep 22 10:26:35 EDT 2004 | sumxp
Beside being reliable,flexible,the after sales maintenance support and spare parts availability in shortest leadtime is equally important. I choose Panasert/Panasonic because of above advantages.You can try MSF which can mount all packages(0201 to bg
