Electronics Forum | Wed Mar 12 10:26:10 EDT 2008 | realchunks
Why would a board failure related problem be a process problem. I agree most companies believe EVERY problem is a Proces Problem, but in the real world we know this is not true. A pad lifting means your solder joint was able to rip it off the boa
Electronics Forum | Thu Apr 07 19:17:43 EDT 2022 | cbart
Good afternoon The ISI I was mentioning is interconnections solutions which is a division of Molex. a few years back we ran into a component end of life situation but had thousands of very high dollar bare boards in stock. the package was a BGA and w
Electronics Forum | Tue May 12 10:03:12 EDT 2009 | daan_terstegge
Hi All, I see more and more components like QFN or LGA with bottom-only terminations,with landpatterns getting finer all the time. I have no ppm-figures of our process, but based on a benchmark study by Agilent I'd say that 500 ppm is a decent value
Electronics Forum | Thu May 24 09:11:12 EDT 2001 | Grant Petty
Hi, I would agree. We purchased a TP9 just the slow machine, but we were a small company at the time, and it worked fantastic. Almost no maintenance, and it's a dream to changeover. The serivce in Australia is also very good, but that does not appl
Electronics Forum | Mon Oct 15 10:51:49 EDT 2001 | davef
On over printing, the general issues are: * Paste deposits being so large that when reflowing, collapse onto many, rather than a single solder mass. * Paste expanding during heating and being close to other solder deposits and bridging [as you say].
Electronics Forum | Fri Jul 07 03:27:31 EDT 2006 | dougs
Hi folks, thanks for all the tips. We have run our first batch of these flexi boards now. I had the PCB suppliers make me some 1.6mm FR4 carriers to lay the boards on to carry them through the process. (1 flat & 1 with cutouts for the second side)
Electronics Forum | Tue Jul 09 15:20:19 EDT 2002 | pjc
When you look at the capabilities of Combo machines they tend to sacrifice performance when compared to separate X-ray and AOI machines, meaning they don't do either the X-ray or AOI operations as well as a machine that was designed to do only one. A
Electronics Forum | Tue Aug 16 09:37:58 EDT 2011 | blnorman
Dye and pry is frequently used on BGAs to determine if there is a crack at the board level or component level interconnect. C-SAM will show internal delaminations of components, not sure how well it would work with solder joint cracks. You can also
Electronics Forum | Wed Feb 24 11:00:12 EST 1999 | Steve Schrader
Are the terms "uBGA" and "Fine Pitch BGA" synonomous, different all-together, or is Fine Pitch BGA a subset of uBGA? Thanks. Steve
Electronics Forum | Mon Jun 12 17:32:17 EDT 2006 | flipit
Hi, A little off subject but I just finished a quick little experiment where I placed 0201 to 1206 and some ceramic resonators at specific distances off the scored edge. The distances from scored edge ranged from 0.025" on up at 0.025" increments.
