779 bga and x-ray results

Electronics Forum: bga and x-ray (Page 10 of 78)

BGA rework and inspection

Electronics Forum | Tue May 28 13:46:27 EDT 2002 | Yannick

Hi, I know that this topic have been discuss before but I would like to know what kind of equipement do you use to check your BGA and to rework it? What should I look for before buying something. Some people said that is not a good thing to

Dye and Pry

Electronics Forum | Wed Mar 12 07:33:40 EDT 2008 | callckq

Hi All, One PCBA failed test after went through the Shock Test(Vibration) and suspected to be BGA solder ball crack. We performed dye and pry and found PCB's pad lifted with red mark ink penetrate pad underneath, what does this mean? Can I say the

Dye and Pry

Electronics Forum | Wed Mar 12 23:00:10 EDT 2008 | davef

You can say: The pad was lifted after reflow and prior to the dye and pry failure analysis. When we see lifted pads, we think: * That's a good solder connection * Either it took a lot of force to lift that pad or the fabrication of the board in the

BGA assembly and inspection

Electronics Forum | Mon Apr 02 17:16:22 EDT 2001 | kward

Try IPC-7095. It is not free , but discusses in-depth Design and Assembly Process implementation for BGAs. Website is ipc.org

BGA and Land Patterns

Electronics Forum | Tue Apr 27 12:32:53 EDT 1999 | Frank Hinojos

What is the current spec for sizing PCB pads for a land grid array? How about for a ball grid array? Are there industry spec's I can reference? Thanks, Frank

BGA lands and ICT

Electronics Forum | Wed Mar 20 15:18:09 EST 2002 | angiewest

You may want to check out IPC-SM-782 "Surface Mount Design and Land Pattern Standard" http://www.ipc.org Good Luck

0201 and uBGA

Electronics Forum | Wed Jun 05 21:33:12 EDT 2002 | davef

Tough to say based on what you have told us. Things to Determine are: * Is the heat at the solder connections that are not reflowing properly adequate? * Is the pad surface of the solder connections that are not reflowing properly solderable?

Dye and Pry Process

Electronics Forum | Fri Apr 01 23:32:39 EST 2005 | ccgooi

Hi, I would like to understand more about dye and pry process for BGA assembly. Can anyone provide me more information about reference about this topic.Thanks.