New Equipment | Rework & Repair Equipment
BGA Rework Stations from the BGA Experts with over 25 years rework process experience and customer support! For high volume BGA Rework on even the largest computer and networking boards! The model SV560A has a high resolution optical system for pla
Industry News | 2013-02-05 14:13:33.0
BGA Rework System Demo Tour
Used SMT Equipment | Pick and Place/Feeders
Yamaha YG100R high speed chip High precision and high speed modular mounter High resolution digital multi vision camera with high performance servo system based on high rigidity and dual drive Original multi precision correction system multi la
Used SMT Equipment | Pick and Place/Feeders
SAMSUNG CP63HP / CP63 High Speed Mounting Machine CP63HP Under IPC9850 conditions, the mount speed is 30,000 CPH The mount range is 0603(imperial 0201) ~ 24mm components, including BGA, QFP PCB large size Max. 500Mm * 400mm Additional 116 8mm fee
Used SMT Equipment | THT Equipment
Very nice Q Corporation Lead Trimmer Cutter For Sale! See attached pictures and information below. Equipment Description •Q Corporation 2000 Series Q2G lead trimmer •Brushless DC drive for low maintenance with dynamic braking •Variable
Used SMT Equipment | Adhesive Dispensers
Speedline Technologies Camalot FXD Underfill Dispensing System with Smart Stream Technology For Sale We have (2) identical systems available..... Both in very good running condition and can be inspected under power..... See attached pictu
Used SMT Equipment | Adhesive Dispensers
Speedline Technologies Camalot FXD Underfill Dispensing System with Smart Stream Technology For Sale (2) identical systems available..... Both in very good running condition and can be inspected under power..... See attached pictures and inform
New Equipment | Rework & Repair Equipment
Hot selling optical motherboard BGA chip rework station for laptop/mobile PCBA chip soldering and desoldering Features: 1.Hot air heater head and mounting head are designed 2 in 1, driven by step electric motor, have both the auto soldering a
Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
Industry News | 2020-03-19 11:12:48.0
Amid the COVID 19 crisis, Precision PCB Services, Inc. remains open and cable to provide quick turn BGA Rework and Reballing Services with offices in Northern California and Dallas, Texas.
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