Electronics Forum | Mon Nov 19 05:49:44 EST 2001 | Cheng
The BGA solder ball composition is 62/36/2 Sn/Pb/Ag, does any problem exist for the solder joint reliability? And what is the difference on SMTA process between this and the normal 63/37 ball?
Electronics Forum | Wed Mar 29 10:07:58 EST 2006 | Slaine
where are your pear shaped balls located? :) you said about 10% of the balls have been affected are they mainly around the egde of the BGA or in the corners ect?
Electronics Forum | Wed Nov 29 00:43:45 EST 2006 | callckq
Dear all, Recently, we run 2 models with heat sink attachment on top of this BGA(on top of this BGA, there is flip chip attached at the center of the BGA). Hence, the center of the BGA is higher than corner/side. We used conventional way to attach
Electronics Forum | Thu Oct 26 14:00:18 EDT 2017 | sambolian
Is there a threshold on ball size where we would not need to re-ball a BGA ( i.e. 8 ball / small type packages).
Electronics Forum | Fri Jul 14 14:46:59 EDT 2006 | Gman
Hello Folks, Has anyone come across this fascinating but undesirable surface appearance of BGA balls. I am not sure what it is called but I came across the term Black Island. To me it looks more like a disco ball. Lets just say the solder ball looks
Electronics Forum | Wed Oct 29 22:41:42 EST 2003 | msimkin
Our design team have got a problem. We need to either drill out 6 vias/pads for a BGA site, or remove the solder balls form the BGA before they are palced. ( std eutectic) Has anyone used a vendor to remove balls from BGA (0.75mm piutch, ball size ap
Electronics Forum | Tue Sep 20 17:38:59 EDT 2005 | kmorris
HLY: If you must build product while you wait to get the printer fixed, and if the BGA balls are eutectic solder, your approach is a good one. All solder paste does in this assembly application is supply the flux. Additional solder volume is not ne
Electronics Forum | Fri Jun 17 23:31:12 EDT 2005 | kenscj
Hi all, currently, we are seeing BGA problem like solder ball misalign, void, solder short (all under BGA, tested with 5DX), after reflow. We examine the solder ball (raw material of BGA), and see that the ball surface is not smooth, will that affe
Electronics Forum | Fri Aug 16 09:59:49 EDT 2002 | dason_c
We baked the board first and print 2 mil water soluble paste at the BGA location and reflow. Wash and baked before the production run.
Electronics Forum | Thu May 13 12:53:49 EDT 1999 | Steve Gregory
| What is the best way to re-ball a BGA? Who has the best system for doing it? | Hello J.J. The easiest and best way I've found to Re-ball BGA's is from a company called Winslow Automation. They make what they call "Solderquik" BGA preforms...cou
