Electronics Forum | Wed May 12 06:57:00 EDT 2004 | davef
You say you have lots of problems with a BGA, tell us about: * Specific problems you see. * Solder paste supplier�s recommended profile. * Temperatures measured on the problem ball[s] of the BGA during reflow. When you say �u1 BGA�, what do mean? W
Electronics Forum | Thu Jan 20 16:45:10 EST 2005 | montec2000
Have a product in production thats has 25+ BGA's at 45 degrees. Have had no problems with these from the placement and reflow stand point.
Electronics Forum | Mon May 12 16:31:39 EDT 2008 | tsvetan
Hi, there are different BGA packages, it's not same to rework LFBGA with 0.5 mm step and BGA with 1.27 mm step for instance basically you will be able to de-solder the BGA with hot air and proper nozzle which distributes the heat even on the BGA pa
Electronics Forum | Wed Dec 01 07:47:57 EST 2004 | jdumont
I have been seeing this with a new BGA we have just started using from IBM. Is this a problem if the solder paste is wetted to the unreflowed BGA balls??? It passed our ESS testing with no problems.... TIA JD
Electronics Forum | Thu May 03 17:34:57 EDT 2001 | oscar mendez
Does any one experienced problems on BGA voids related to height of chip (placement), and also another question, Does any one has some statistical process control for the BGA soldering process? if the answer is yes, I'd like to have advice from you.
Electronics Forum | Mon Dec 30 13:52:50 EST 2002 | bcceng
Haran, This problem can also be caused if the BGA package is POPCORNING. Popcorning causes the BGA package to expand below the die, seen this happen so often to customers that try to install BGA's themselves without the proper handling of BGA's. Tha
Electronics Forum | Mon Sep 24 20:38:27 EDT 2001 | davef
Mike's comments are well taken. Your technique works fine with BGA, but uBGA are less forgiving. Again, let's take about: * Specifics of the problem. * Amount and method of applying flux. * What's holding the uBGA in-place before the solder ball an
Electronics Forum | Mon Nov 24 11:19:21 EST 2008 | sjones
I am having problems soldering a Rohs compliant BGA ATMEL AT91RM9200(rohs compliant board) This device recommends a soldering profile from J-STD-20 and a minimum peak package temperature of 250 centigrade,peak 260. However a lot of the other componen
Electronics Forum | Mon Nov 24 11:26:08 EST 2008 | sjones
I am having problems soldering a Rohs compliant BGA ATMEL AT91RM9200(rohs compliant board) This device recommends a soldering profile from J-STD-20 and a minimum peak package temperature of 250 centigrade,peak 260. However a lot of the other componen
Electronics Forum | Wed Nov 01 09:01:55 EST 2000 | Thomas Ballhausen
Since your problem has been posted quite some time ago I am eager to know, if you have got any clue. One of my customers recently claimed our 313-PBGA causing problems, as one of its balls (randomly) is almost dewetting. So no evidence is found by x-
