Electronics Forum | Fri Nov 09 20:15:26 EST 2001 | caldon
I concur with Dave.....I have done this often with little fall out. After rework reflow we would x-ray just to ensure an acceptable joint structure. Just for curiosity sakes....are you removing a defective BGA and replacing with a good one? Site pre
Electronics Forum | Mon Mar 19 08:26:37 EST 2001 | hany_khoga
Dear All: We have a problem of soldering big BGA's (3.5Cm * 3.5 Cm)during rework or repair. With three big companies stations (hot air & infrared) with their support, they faild to re-solder even one BGA succesfully. Note that we workes on a good te
Electronics Forum | Tue Oct 31 19:56:18 EST 2000 | Massimo
I'm reworking BGA with a "SRT Summit 2000". This machine uses a nozzle of the same size of the BGA to conduct nitrogen to the top of the BGA. When I rework big PBGAs (318PBGA, 388PBGA) I've got shorts at the corners (100% of the times!). I think the
Electronics Forum | Tue Mar 20 06:47:56 EDT 2007 | realchunks
I agree with CL. Most people blame the BGA cause it's a mystery chip to most people. Only after replacing the BGA several times do most people look else where. 90% of the time it's something else. Doing all your engineering work up front is the
Electronics Forum | Mon Mar 19 06:05:16 EDT 2007 | chrissieneale
Hello - what's coming up as the top reason for BGA rework? Are there more handeling issues than actual problems with SMT placement / rework? Sorry it's a really general question, but i'm after some really general answers. :) Chrissie
Electronics Forum | Tue Feb 20 16:56:36 EST 2001 | davef
There has been substantial amount of FEA done on predicting BGA ball reliability, but this has most often been applied to assessing the reliability of the design of products, rather than the effects of rework. This sounds like an interesting proje
Electronics Forum | Fri Oct 26 06:25:56 EDT 2001 | John
Undertaking tricky rework project to remove two BGA's in close proximity to two press fit dip sockets any guideline sone should use??? proceddure ,process control etc
Electronics Forum | Fri Nov 09 10:25:43 EST 2001 | steven
is it all right to reflow a BGA using a rework station but without applying a layer of solder paste on pcb. the diameter of the solder ball is 0.75 and the pitch is 1.5mm.
Electronics Forum | Tue May 14 20:58:42 EDT 2002 | davef
Maybe the issue is not a proper rework method. Your shorts on the corners are caused by too fast of a profile causing the corners of the BGA to get too hot, too fast, which made them curl, like tatter chips.
Electronics Forum | Wed Mar 10 00:25:36 EST 2004 | kanwal324
We have the expertise of mounting and rework of all types of bga without facing any problem. If you want or you can give us one oppurtunity. K S Walia Xo Infotech Ltd. India
