Electronics Forum: board warp (Page 10 of 34)

CCGA solderability criteria

Electronics Forum | Sat Jun 21 23:15:07 EDT 2008 | mika

Also keep in mind that the CCGA column length tolerance is at minimum +/- 0.13mm from most part manufactures and they don't collapse in the same way as a BGA, therefore the paste height deposit could be critical in some rare circumstances. Board warp

Re: Paste-in_hole and CTE

Electronics Forum | Thu Jul 27 21:34:41 EDT 2000 | Dave F

Gary: That's curious. Tell us more about your process steps, temperature profiles, paste, warping of the board without the PIH processing, components, etc

MPM UP2000 Hi-e

Electronics Forum | Wed Aug 30 06:56:34 EDT 2006 | billyd

Keep in mind; if you're building warped or twisted boards, do NOT use the Grid-lok system on them, as they tend to conform to the bend or twist of the underside of the PCB, so it will not flatten or straighten out much at all when it's brought to the

PCBA flatness

Electronics Forum | Mon Mar 13 22:29:50 EST 2006 | davef

Warp depends on: * How close the board gets to its Tg during the reflow cycle (the closer you get to the Tg the worse the warp gets) * Amount of copper on each side and the balance between the two * Thickness of the board * Overall length x width * T

Boards Bowing

Electronics Forum | Mon Oct 03 22:12:53 EDT 2005 | davef

When we see warp and twist, we usually jump the fabricator for: * MLB construction (not homogeneous or unbalanced - too resin rich or poor) * Supplier process capabilities (lamination cycles) * Material selection (usually cheap and dirty), etc. War

Urgent!! ... AI process after SMD Reflow Soldering

Electronics Forum | Thu Sep 15 10:00:28 EDT 2005 | slthomas

I'm curious about one thing. What kind of components are on the bottom, how many are there, and how are you processing (in particular how do you get glue and paste on) them? Edited to add: You shouldn't have any problems (assuming your tooling heigh

Pick Up Error

Electronics Forum | Thu Aug 05 20:33:48 EDT 2004 | Dhanish

The machine type is Fuji CP6.We have major issues with Network Resistor placement.The equipment guys often feedback there is a problem with nozzle and feeders.What will happened to the part if the Thickness data in the Part Data does not match the Pa

MPM UP2000 Hi-e

Electronics Forum | Thu Sep 07 09:04:24 EDT 2006 | Doug Eidle

Hi, First off, I am the Pre Owned Equip. Business Mgr. for Speedline Technologies. We have a factory Renewed (our enhanced refurbishment process) available. You can contact your local Speedline MPM Rep for price and information. If board warp is

Re: PCB warpage

Electronics Forum | Fri Oct 15 11:05:50 EDT 1999 | Mark Phinney

Earliar we had problems with board warpage, Much of our problem was due to imbalances in the copper on oppisite layers in brief on a 8 layer board the copper on layer 1 should = the copper on layer 8, 2=7, 3=6, 4 = 5. We added copper to some layers t

warped boarf after reflowing

Electronics Forum | Mon Sep 17 06:11:41 EDT 2012 | kq702

Hi I did a reflow on a laptop board and after the reflow the board is warped in the area I did the reflow in, and now the laptop screen does not turn on at all when I put it back into the laptop. Original problem was the wifi (I did the reflow more o


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