Electronics Forum: bottom (Page 10 of 227)

SMT assembly

Electronics Forum | Mon Mar 09 03:45:19 EDT 2009 | nagesh

I have a double sided assembly board having more no. of QFP's & IC's at both Top & bottom.Is there any concern about this??.COz. i have the profile set to be almost same for Top & Bottom.Worried whether bottom side IC's fall/ Shift during Top side re

Can we check polarity and upside downs on My100?

Electronics Forum | Wed Aug 05 09:41:50 EDT 2015 | kmots15

For upside down and rotated parts try using the index mark (F6) in the package database for that component, at least then the machine should look for a unique feature on the bottom and if it cannot find it the part will be rejected. For the index ma

Reflow oven profile

Electronics Forum | Fri Dec 02 01:49:48 EST 2016 | jeya7376

I want to do improvement in conversion time. We running small quantity board and frequently do conversion. we produce very simple board no BGA only resistor, capacitor, LED, IC and transistor. We are running same model top and bottom in 1 reflow oven

Reflow Oven

Electronics Forum | Tue Aug 13 10:39:50 EDT 2019 | sankarseptember

We are using Wertheim SMT Reflow oven.We are facing component drop issue from bottom side while top side is running. The drop components is diode,3 pin transitor which not even too heavy..We are also getting tombstone in bottom side Chip capacitor wh

Re: DOUBLE SIDED SMT ASSY

Electronics Forum | Thu Oct 28 04:52:27 EDT 1999 | Paul Gerits

Hi Jerry, normal proces would be; 1st. reflow side (top) 2nd. curring side (bottom) 3rd. insert 4th. solderwave Reason for this is that you have a better handling and no overdue stress to components in case you do bottom before top. It is also eas

Mirrored BGA Assembly

Electronics Forum | Thu Jul 15 12:02:38 EDT 2004 | Yngwie

We have massive void problems on one of the BGA populated on the bottom side of the board. The board have 6 BGAs on the top and 1 on the bottom. No voids were observed during the first reflow (we reflowed bottom side first), but after the second refl

Mirrored BGA Assembly

Electronics Forum | Fri Jul 16 03:35:34 EDT 2004 | Yngwie

We have massive void problems on one of the BGA populated on the bottom side of the board. The board have 6 BGAs on the top and 1 on the bottom. No voids were observed during the first reflow (we reflowed bottom side first), but after the second refl

BGA chip corner epoxy / adhesive?

Electronics Forum | Wed Dec 06 22:35:05 EST 2006 | davef

Questions are: * When you say, "corner of some board's BGA chips", is it on the top of the package or between the board and the bottom of the package? * If between the board and the bottom of the package, does it span the distance between the board a

Bottom side adheasive

Electronics Forum | Mon Dec 15 16:08:41 EST 2008 | dyoungquist

We have been running double sided surface mount pcb assembly for several years with no adhesive needed. We paste, place and reflow one side, then repeat the process for the other side. With Rs, Cs and small to medium ICs we have no problem with par

Re: Fine Pitch 48-pin TSOP

Electronics Forum | Fri Dec 01 01:42:09 EST 2000 | PeteC

I recommend paste print-reflow the bottom side then use a selective wave solder pallet to mask the SMT components on the bottom side. PeteC


bottom searches for Companies, Equipment, Machines, Suppliers & Information