Industry News | 2008-08-11 23:49:45.0
LITTLETON, MASS. - VJ Electronix, the leader in X-Ray inspection technology and Rework systems, announces that it will exhibit PMT400 Rework System in booth 825 at the upcoming SMTA International exhibition and conference, scheduled to take place August 19-20, 2008 in Orlando, FL.
Industry News | 2008-10-07 12:56:56.0
APS Novastar introduces automatic Vision Control for its L-Series pick and place systems. Vision Control advances the already precise, fast and reliable placement of 0201's with 100% accurate on-the-fly, bottom-up vision placement of micro BGA's and ultra fine pitch QFP's.
Industry News | 2009-10-01 13:19:08.0
The new dual-head MC-385, Manncorp’s latest addition to its popular MC Series of pick-and-place systems, claimed to deliver greater flexibility, higher throughput and lower cost of ownership, will be premiered at SMTA International in San Diego.
Industry News | 2011-06-13 18:06:01.0
Practical Components announces that the new Practical Components TMV® (Through Mold Via) 14 mm Board Drop Test Lead-Free Kit is now available. The kit is designed for the 14 mm Amkor TMV® component.
Industry News | 2008-06-30 14:17:39.0
LOS ALAMITOS, CA � June 30, 2008 � Practical Dummy Components is now supplying the Amkor FusionQuad�, representing a breakthrough in leadframe-based plastic packaging through the effective integration of ExposedPad� QFP and MLF� technologies.
Industry News | 2015-05-11 17:16:30.0
KYZEN is pleased to announce that Debbie Carboni will present at the IMAPS METRO Chapter Full Day Symposium and Vendor Night, scheduled to take place Wednesday, May 13, 2015 at the Clarion (former Holiday Inn) in Ronkonkoma, New York. Carboni will present the paper entitled, “Advanced Packaging Cleaning Fluid Best Practice.”
Industry News | 2015-10-21 16:18:26.0
GETECH announced today that it will unveil its all-new GBR Bottom Router Machine in Hall A3, Booth 405 at Productronica, scheduled to take place November 10-13, 2015 at the Messe in Munich, Germany.
Industry News | 2016-09-07 18:44:03.0
KYZEN announces that Dr. Mike Bixenman will present the recent paper entitled, “Reactivity of No-Clean Flux Residues Trapped Under Bottom Terminated Components” during SMTA International. The paper is co-authored by Bruno Tolla, Ph.D., Jennifer Allen and Kyle Loomis from Kester and will be presented during the “Flux, Solder, Adhesives Track” on Tuesday, September 27, 2016 at 3 p.m.
Industry News | 2003-06-20 18:28:55.0
Makes continuity and placement evaluation a snap.
Industry News | 2007-10-29 16:48:09.0
At the Productronica 2007 tradeshow in Munich, Germany, FINETECH will present a new solution for contactless board temperature measurement � the infrared start sensor.