Electronics Forum | Fri Aug 13 07:26:06 EDT 1999 | Brian Conner
| | We are using a mixed technology process with mostly through-hole parts plus some SMT IC's on the component side and some passive SMT parts on the solder side. We do not have a proper wave soldering machine for doing solder side SMT (double wave
Electronics Forum | Mon Oct 04 07:47:34 EDT 1999 | park kyung sam
| | What are pro's and con's of reflowing top side first and curing bottom side chip components, and then wave soldering bottom side? | | | | How about curing bottom side first and reflowing top side later? | | | | What percentage of companies run
Electronics Forum | Sat Mar 28 06:59:03 EDT 2015 | robertwillis
I would agree with the comments so far its much better to have some pre heat. You have not explained why bottom side preheat is a problem. Even having some input will help balance the process. Assume there is some thing on the back side that is a pro
Electronics Forum | Wed Jul 02 08:07:03 EDT 2008 | realchunks
Try adjusting your monitor - it may be there, just out of view.
Electronics Forum | Wed Jul 02 08:56:05 EDT 2008 | proy
I tried that! Peter
Electronics Forum | Tue Jul 01 18:51:06 EDT 2008 | proy
I am learning to use this SPM now, and I found that when I go to define a board size, you select the parameter box, then the parameter (like Board size X....) - I can only change the value by rolling the mouse ball, the side bar which is shown in the
Electronics Forum | Fri Aug 13 10:19:35 EDT 1999 | Boca
| | We are using a mixed technology process with mostly through-hole parts plus some SMT IC's on the component side and some passive SMT parts on the solder side. We do not have a proper wave soldering machine for doing solder side SMT (double wave
Electronics Forum | Fri Mar 27 12:59:22 EDT 2015 | ppcbs
That is a strange task. I must ask what is the purpose? When performing BGA Rework the goal is to recreate the manufacturing process of using the reflow oven. It is important to have even heat of the BGA and PCB from top to bottom. Using top heat o
Electronics Forum | Wed May 20 17:56:51 EDT 2009 | dyoungquist
I have attached a pdf showing the dimensions for the QFN we placed. First, The pins on the part are not only on the bottom side but also wrap around to come up each of the 4 sides of the part as shown in the side view in the attached pdf. This i
Electronics Forum | Fri Dec 11 09:06:57 EST 1998 | Tom
| Has any body tried reflowing QFP's on both sides of a board. | GCollier Yes we do that quite often, we are using QFP132 with 0.5mm pitch in pure reflow process for both sides (no glue). It works well, the only problems we have seen was wiht compon
