Electronics Forum | Wed Feb 24 07:56:53 EST 1999 | Brian C
Under IPC-A-610 Section 10.3(Components on their sides) it reads: ______________________________________________________ Acceptable - Class 1,2 Nonconforming Defect � Class 3 Chip components on its side provided the following are met: Chip
Electronics Forum | Wed Feb 24 10:56:12 EST 1999 | Steve Schrader
| Under IPC-A-610 Section 10.3(Components on their sides) it reads: | ______________________________________________________ | Acceptable - Class 1,2 | Nonconforming Defect � Class 3 | | Chip components on its side provided the following | are
Electronics Forum | Wed Sep 23 20:38:30 EDT 1998 | parag
does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap.
Electronics Forum | Tue Sep 01 14:11:27 EDT 1998 | Matt
How would you mount a surface mount chip onto Perf board? I am doing a project for school and one of the chips is a surface mount, but everything else fits in Perf board. Any suggestions? Thanks
Electronics Forum | Tue Jun 16 16:03:52 EDT 1998 | Diane Rogers
Does anyone have experience working with flip chips? I would like to know how to work with them, some precautions, inspection techniques, etc. Thanks! Diane...
Electronics Forum | Mon Jun 15 14:00:32 EDT 1998 | Pete
Yes, whats your issue..... | Does any one wave solder the 0402 Chips on the bottom side of a board? | Any comments?
Electronics Forum | Thu Apr 09 12:13:22 EDT 1998 | raymond
What is the pro & con of using flux dispensing vs flux dipping method for flip chip assembly ?
Electronics Forum | Mon Mar 09 09:59:52 EST 1998 | Olivier de Brouwer
What is the expected of soldering chip inductors directly over chip capacitors. What is the expected life reduction in the field and what could be done to minimize it ?
Electronics Forum | Tue Mar 10 09:10:23 EST 1998 | Olivier de Brouwer
| What is the expected reliability of soldering chip inductors directly over chip capacitors. What is the expected life reduction in the field and what could be done to minimize it ?
Electronics Forum | Fri Feb 20 20:08:18 EST 1998 | Chang Woo Cho
I am looking for component placer that can handle not only smc but also flip chip C4. If there is any machine satisfying my request, please inform me. machine name , spec, and so on.
