Electronics Forum | Sun Jul 29 09:17:20 EDT 2001 | davef
Tough to say, but ... Chlorine: Many fluxes contain chlorine. Sulphur: Many solders and paper packing materials contain sulphur. Sodium: No idea. IPC-J-001 talks to board cleanliness and specifies criteria according to the cleanliness test met
Electronics Forum | Fri Nov 12 10:40:17 EST 1999 | Dave F
Some under-the-hood automotive people have moved from no-clean to clean, and I mean CLEAN, recently. Hmmmm Dave F
Electronics Forum | Fri Nov 05 03:53:29 EDT 2010 | Mark
The smallest particle sixe for type 3 paste in 25 microns. This is far to big to remain airborne.Therefore I would suggest to continue to use air to clean stencils as it does clean the apertures effectively.What solvent is used to clean the stencils?
Electronics Forum | Wed Feb 26 22:22:00 EST 2003 | Grant Petty
Hi, The guys here have some boards that have been reworked however as we use no-clean paste we are getting the white residue after ultrasonic cleaning. We are using an alcohol based cleaner in the ultra sonic cleaner. Does anyone have any ideas, or
Electronics Forum | Mon Oct 23 14:05:08 EDT 2000 | Aokilab
Hi Soza: As Dave F mentioned, there are lot of factors involving the formation of residue, after cleaning. Factors, (such as: solvent's cleaning power, presence of metal oxides, type of soldering flux, etc...). One thing pretty sure, IPC is usually
Electronics Forum | Tue Apr 27 08:14:59 EDT 2004 | iqbal
Is anybody doing BGA soldering water clean solder. If yes how you are ensure cleaness. We have boards with Four BGA and 2000 chip and ICs.We are processing with no clean solder but we are getting bad wetting so now we are planning to switch to water
Electronics Forum | Wed Apr 28 22:35:32 EDT 2004 | davef
We can clean the blank out of LARGE BGA. [Cleaning small BGA is a whoooole nuther issue.] But before we get into that, what's the problem and its breadth? Why are you getting poor wetting? What's the story on the components, board, process materia
Electronics Forum | Thu Jun 08 16:46:07 EDT 2006 | proy
I would like to use a no clean paste on an assembly, but seams most no cleans only get to SIR values of 10 E10 or so. Can anybody recommend something with a higher SIR residue? Peter
Electronics Forum | Tue Sep 02 14:59:41 EDT 2008 | hermes
if two boards with different solder masks give different results on flux residue level after soldering with the exact same machine settings than it is clear that one of the solder masks is not compatible with your no-clean flux. could be the solder m
Electronics Forum | Fri Nov 05 12:25:42 EDT 2010 | deanm
I think you are right. According to IPC-7526 section 6.2 says that using compressed air to blow out paste will damage the stencil, especially between fine pitch apertures. It can also broadcast solder paste onto other surfaces or personnel. I recomm
