Electronics Forum | Wed Jun 05 12:22:45 EDT 2002 | Bob
No. Placement force is fine. Also boards have been inspected prior to reflow using microscope with no evidance of misplaced solder balls. The ramp rate has been reduced to acceptable limits, typically .8 - 1.5 degrees per sec. Outgassing from eithe
Electronics Forum | Mon Nov 12 09:37:17 EST 2007 | russ
You need to perform process a capability study prior to putting these controls into place. Cleaning a stencil after each pass will get ugly, solvent residues remaining in apertures etc. 2D inspection is good. Change paste every hour will get very
Electronics Forum | Mon Oct 23 06:51:36 EDT 2000 | fastech6
I have a problem with solder getting into exposed gold pads. What is the best rework procedure for removing the solder and restoring the gold condition of the pad? At the moment, we are also covering the gold pad with kapton tape prior to solder
Electronics Forum | Tue Apr 13 14:49:15 EDT 2010 | davef
90%) from the sample, and the bake time and temperature specified herein are minimums. To improve test accuracy, or to prevent heat damage, other bake parameters may be AABUS. 2 Applicable Documents IPC-QL-653 Certification of Facilities that Inspect
Electronics Forum | Mon Mar 02 13:06:36 EST 2020 | charliedci
If you add any "flux cored" wire solder to the pot make sure you have ventilation as the flux will burn off and smoke like crazy. This solder pot is like any used in a wave or selective solder, no flux. The flux is added to wire prior to di
Electronics Forum | Mon Jun 18 21:46:27 EDT 2001 | davef
It's possible that combining these two fluxes is benign, you sure can't say your customer is wrong, can you???? So, what is the intent of leaving these two different flux materials on your board? What is the residue remaining on your board as your
Electronics Forum | Thu Jul 09 21:17:18 EDT 1998 | Dave F
According to Howard, we clean the flux tank on our wave solder machines every week. We replace it because flux sops up moisture from the air and contaminating materials from boards that are being fluxed prior to soldering. How would a prudent perso
Electronics Forum | Fri Aug 18 14:00:27 EDT 2006 | slthomas
Chunks is a pretty with-it dude. The only additional thought I have is the possibility of poor misprint cleaning. If they're wiping instead of spray or US washing they may be contaminating the boards prior to reprinting. And yes, I know Chunks is
Electronics Forum | Thu Sep 11 16:14:59 EDT 2008 | adamcrum
Our DI system has a carbon cylinder and a mixed bed cylinder. This is from the Mfgr website: "The Technical Devices' Nu/Clean Recirculating Water Deionizing System is engineered to remove all organics, chemicals, and heavy metals via particle
Electronics Forum | Tue Sep 22 08:35:47 EDT 2009 | cman
Did you try pre-tinning your board on this suspect pad/s to see if it improved wetting/solderability prior to printing/SMT placement and reflow? Does the pad/s not soldering tie to a ground layer? I would connect a T/C to each pad of the same part an