Electronics Forum: common (Page 10 of 133)

DFM REPORT

Electronics Forum | Thu Jul 12 21:21:24 EDT 2001 | mugen

Hear! Hear! Hark do we hear the ringing bell of the town crier? DFM = design for manufacturability covers PDCA cycle for prototype and practically anything that needs engineering (common sense inclined) review, under the glorious sunny radiant heat

Re: Single profile?

Electronics Forum | Wed Feb 02 11:49:18 EST 2000 | Greg Jones

HJ: We presented a paper on how to accomplish this at Nepcon 99: Reducing Oven Changeover Time by Finding Common Recipes for Mixed Production Lines It is available at: www.kicthermal.com/library/index.html Good Luck, Greg

Re: nozzle - terminology

Electronics Forum | Fri Dec 17 19:07:47 EST 1999 | Dennis

There are two types of nozzles most commonly used nozzle is vaccum type. but when it comes to odd component which is not standard either plain form. must use machenical grapper to pick up the component

Re: Solder Paste Measuring

Electronics Forum | Mon Apr 05 21:41:00 EDT 1999 | Russell Bartley

| I need help in finding solder paste measuring equipment. | As already mention in other replies the Cyberoptics and others are commonly used but the price and the measurement range must be considered since you can purchase paste measurement equipm

Print Height Variation

Electronics Forum | Wed Feb 10 15:49:53 EST 1999 | Gary Sickenger

Helo, Is it common for actual print height of solder paste to exceed the stencil thickness. For example If the stencil is 6mill thick and the actual height of the print is apx. 10 or 11mill. What causes the paste height to be greater than the sten

decapsulation

Electronics Forum | Tue Nov 24 13:55:17 EST 1998 | trien pham

I have a COB device that I need to decapsulate for failure analysis. I would like to find out how I can do it using common materials/process that I can easily find. Thank you and I look forward to hearing from you soon.

Re: Step down stencil

Electronics Forum | Sun Nov 22 17:54:08 EST 1998 | Larry Johnson

| Does any body know stencil manufacturer in states or south east asia for electroforming processes and step down from 5mil to 3mil. | | Thanks! | Any screen shop should be able to handle that task. It is failry common these days.

Suggestion For Additional Information

Electronics Forum | Thu Sep 24 21:32:20 EDT 1998 | Larry

What do you think about sections for the following: 1 "Tips & Techniques" a question and answer format for archiving FAQs 2 "Terms & Definitions" of common and uncommon items

Embrittlement Sucks.....

Electronics Forum | Fri Aug 21 13:46:50 EDT 1998 | Ben Salisbury

It's been one hell of a week.... From personal experience, what are the most common causes for embrittlement of the solder joint? I just need to make sure I've got all my bases covered. thanks -Ben

Fuji QP

Electronics Forum | Tue Jul 14 09:08:10 EDT 1998 | Jim Smith

Hi, I'm an SMT tech in a major OEM in Scotland and we have just purchased two Fuji QP's. Does anybody out there have a list of do's and don'ts especialy regarding preventative maintenance and common faults.


common searches for Companies, Equipment, Machines, Suppliers & Information

Equipment Auction - Eagle Comtronics: Low-Use Electronic Assembly & Machining Facility 2019 Europlacer iineo + Placement Machine  Test & Inspection: Agilent | Tektronix | Mantis Machine Shop: Haas VF3 | Haas SL-20 | Mult. Lathes

World's Best Reflow Oven Customizable for Unique Applications
PCB Handling with CE

High Precision Fluid Dispensers
Selective soldering solutions with Jade soldering machine

High Throughput Reflow Oven
Equipment Auction - Eagle Comtronics: Low-Use Electronic Assembly & Machining Facility 2019 Europlacer iineo + Placement Machine  Test & Inspection: Agilent | Tektronix | Mantis Machine Shop: Haas VF3 | Haas SL-20 | Mult. Lathes

Training online, at your facility, or at one of our worldwide training centers"


"Heller Korea"