Electronics Forum: component and spacing (Page 10 of 111)

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Thu Jul 15 14:38:38 EDT 1999 | JohnW

| | | | | | Hi, | | | | | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants)

Re: Standard pad sizes for reflow and wave

Electronics Forum | Sun Sep 05 03:52:11 EDT 1999 | Brian

| We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these sizes

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Tue Jul 13 14:19:00 EDT 1999 | JohnW

| | | Hi, | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | | | Sec

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Tue Jul 13 14:25:57 EDT 1999 | Earl Moon

| | | | Hi, | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | |

Re: Siemens HS50 and F5 and S25

Electronics Forum | Wed Dec 06 23:12:09 EST 2000 | Brad

Chris, Have you considered Fuji? The robustness of Fuji is proven. I have recently done floor space analysis and cost per placement/sqr foot studies. I have also performed ROI studies on these machines. The new CP7 machine from Fuji outperforms th

"Gap" in completed solder joint between lead and pad

Electronics Forum | Wed Nov 29 10:10:50 EST 2006 | M. Sanders

I'm sorry, Dave - I didn't make myself very clear. Yes, this space (not really a "gap") is filled with solid solder. For instance, if you place a gull-wing component in solder paste, after reflow, there will probably be a thin film of solidied solder

MY15 and MY19

Electronics Forum | Wed Apr 28 23:18:09 EDT 2004 | Grant Petty

Hi, Ours are inline, and depending on how you have the conveyers, you might need to use the data sheets to work out placement. If your running the conveyers behind the machine, then most of the machine is in front of the conveyer, so they use more s

Yamaha YS24 and YS12

Electronics Forum | Fri Aug 29 04:33:52 EDT 2014 | mun4o

Hi all, we have 2 smd line with 2 topaz x|| each.The machines are 10 year old.Now we need more capacity and I am looking for new line.Because there is not space for third line , we must change the p&p with more productive machines.I like Yamaha , an

Re: MoonMan and Tetras

Electronics Forum | Mon Apr 26 17:31:14 EDT 1999 | Earl Moon

| Hey MoonMan, | | Did I catch in one of your fabulous threads that you're using Tetra stencils? I'm anxious to find out how you're liking them. | | We we're all set up to go to Tetras, then mgt decided to close down our factory - Dooop! "Foiled"

Simultaneous pick up with 0402 and 0201 components

Electronics Forum | Fri May 06 07:58:33 EDT 2016 | cyber_wolf

Darby, I'm not completely sure I understand. Juki machines have what is referred to as a multi-head. The offsets between the heads are the same as the spacing between 8mm feeders. So the (6) heads all come down at once and "gang pick" from 6 8mm fee


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