Electronics Forum | Mon Sep 13 21:18:29 EDT 1999 | Dave F
| Hi, | | Recently encountered missing components problem at the SMT process. | Among 13 chip components from the same part number mounted on the board, only 4 ( located in a same row and next to each other) were missing after post reflow. Checked t
Electronics Forum | Tue Jul 24 19:26:20 EDT 2001 | johnmaetta
Thanks Dave. We develop high-speed telecom PCB assemblies that use uBGA and other fine pitch components. Our policy has been to use an NC process at our CM. Our engineering group, who is also a customer, and uses these assemblies for development,
Electronics Forum | Sat Aug 28 14:23:52 EDT 1999 | JohnW
| Hi There, | | Could anyone please give me some pointers on screen printing non-conductive adhesives or where I could find the information avaliable. Aspects such as printing parameters, ideal stencil design and a general overview. Do already have
Electronics Forum | Fri Mar 13 15:09:20 EDT 2015 | marcelorotofrance
Hello everybody Lately our machine has been working pretty well, but it can’t last too long. Now, during this week’s production cycle, it began to increase the component’s reject rate to alarming levels (obviously the operators reported me when the m
Electronics Forum | Mon Jan 29 10:50:35 EST 2007 | mika
What about the component placement with Head #2? Head # 1 is ok? Is it only the pickup that is the problem and if so, from all feeder banks (front & Rear)? Concider Z-axis height adjustment, procedure is in the manual. You normally don't need to re-
Electronics Forum | Tue Dec 07 10:47:09 EST 2010 | walkbury
As a high mix, low volume CEM who deal with a lot of free-issued kits, we are heavily reliant on foil (tape cover) extenders. We don't usually bother with splicing as our machine feeders (Simenes Siplace and Samsung SM321) are designed in such a way
Electronics Forum | Tue Sep 14 21:56:34 EDT 1999 | KEVIN SIMPSON
| | Hi, | | | | Recently encountered missing components problem at the SMT process. | | Among 13 chip components from the same part number mounted on the board, only 4 ( located in a same row and next to each other) were missing after post reflow. C
Electronics Forum | Wed Sep 21 10:40:18 EDT 2005 | PWH
Splicing for us has been a rough go as we haven't really found a tool that works well/fast. We have a few different machines = different feeders. They all react different to a splicing "style". The best so far is a crimp tool that crimps a brass s
Electronics Forum | Thu Jun 22 19:43:05 EDT 2006 | davef
We hope this meets your standards for acceptable responses. * http://www.uic.com/wcms/images2.nsf/(GraphicLib)/Time_Pressure_Dispensing.PDF/$File/Time_Pressure_Dispensing.PDF * On the Flow Rate Dynamics in Time-Pressure Dispensing Processes; X. B. C
Electronics Forum | Thu Aug 10 10:13:11 EDT 2006 | pjc
I have never seen any industry standards for setting up an SMT assembly facility, but I�ll offer some basic advise. An ideal SMT assembly facility is one that is clean and well lit and has environmental controls to maintain temp and RH. Temp of 24C (