Electronics Forum | Fri Oct 25 13:23:02 EDT 2019 | SMTA-Joe
Hello SMTA, This may be beyond the scope of the SMTA since it does not strictly deal with assembly of electronics, rather, it is about potential solderless methods for manually tuning RF circuits. Our Engineers & QC have tasked manufacturing with
Electronics Forum | Thu Nov 22 12:56:12 EST 2001 | tony_sauve
Thanks for the comments & suggestions. Here's some info garnered from a telecon w/the PCB Fab house: -the blind via's extend from layer 2-17...this was a revelation. The info from our customer was that the via's only extended down 2 layers. Did I men
Electronics Forum | Wed May 19 10:48:40 EDT 1999 | Glenn Robertson
| | | We are currently looking at purchasing some BGA rework equipment. Could someone give us the pro's and cons of IR heating (top/bottom)vs. hot air convection ? | | | All other tips are also welcome. | | | | | | Thanks | | | | | Philip, | | I ha
Electronics Forum | Tue May 26 15:05:39 EDT 1998 | Justin Medernach
| | I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). | | Earl Moon | Earl: We send the BGAs to a service "re-baller." Dave F | | PSI, 16833
Electronics Forum | Tue May 26 18:24:05 EDT 1998 | Earl Moon
| | | I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). | | | Earl Moon | | Earl: We send the BGAs to a service "re-baller." Dave F | | | | P
Electronics Forum | Wed May 27 11:13:38 EDT 1998 | Justin Medernach
| | | | I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). | | | | Earl Moon | | | Earl: We send the BGAs to a service "re-baller." Dave F | |
Electronics Forum | Mon Apr 16 09:01:18 EDT 2007 | Steve
The best station I've ever worked with is a focused IR station from PDR. The station that I had was called a; "Lightmaster Pro". They have a different model name now, but you can see a datasheet for it at: http://www.pdr.co.uk/Datasheets/PDRX410-IR-
Electronics Forum | Wed Aug 16 16:43:47 EDT 2000 | Steve Thomas
O.K., I give up. I am through trying to solder thermocouples on to 20 mil pitch QFPs. Whether it's my lousy technique (fairly likely), the wrong solder (Kester calls it thermocouple solder, and who am I to argue...it's a Sn10Pb88Ag2 alloy) or just
Electronics Forum | Tue Dec 11 18:50:47 EST 2018 | vinzon02
HI Rob; The thermal conductive adhesive needs to apply heat to stick on PCB. It's surface has not adhesive tape to fix it before placement of IC. Process: 1.Place the epoxy adhesive tape on PCB. (IC middle part area) 2.Apply heat on epoxy adhesive
Electronics Forum | Thu Jul 15 14:38:38 EDT 1999 | JohnW
| | | | | | Hi, | | | | | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants)
