Electronics Forum | Tue Apr 20 20:11:58 EDT 2004 | davef
First, how oxidized are these solder balls? Will the take solder using your routine flux / paste? Second, on restoring solderability, the three basic methods you can use to restore solderability on components are: * Highly active fluxes in a retinn
Electronics Forum | Mon May 10 20:46:25 EDT 2004 | davef
The three basic methods you can use to restore solderability on components are: * Highly active fluxes in a retinning operation. * Surface stripping chemistry and then a standard retinning operation. * Electrochemical conversion chemistry and then a
Electronics Forum | Mon Dec 20 21:01:12 EST 2004 | davef
Bare inconel is NOT ment to take solder, because * Nickel develops a tenacious oxide layer that is very difficult to remove since the nature of the oxide is very dense, coherent, etc. * Chromium is difficult to solder. * Iron is difficult to solder.
Electronics Forum | Thu Nov 16 11:45:15 EST 2006 | markb
I still think the best bet is probably an SMT pre-bake operation to ensure that there is no moisture in the board. Vapor pressure is usually the leading cause for delamination, so removing the source should significantly help out. Unfortuantely, pr
Electronics Forum | Mon Oct 19 15:08:14 EDT 2009 | markhoch
Would be glad to offer some assistance, but I've got a couple of questions first: 1) What type of supplemental flux are you using? (If any) 2) Is your problem consistent across all assemblers, or can you trace the assemblies with solder ball issues b
Electronics Forum | Thu Aug 24 12:08:51 EDT 2017 | jellevandoornik
Hello, I am looking for the name of a type of connector that connects wires on one side and simply slides on the side of a PCB to connect. The PCB has copper lines on the surface (so no connector part rigidly mounted to the PCB). Can anyone help me
Electronics Forum | Thu Jul 15 19:05:58 EDT 1999 | Earl Moon
| | | We have been encountering diminishing ball shear readings these past few weeks, despite the fact that we did not change any ball shear tester parameter. Our reflow parameters are also within spec limits. ( 210-220 deg C max temp. and 40-60 sec
Electronics Forum | Tue May 19 05:42:36 EDT 1998 | Earl Moon
| Earl, | I admit that I missed your article since I seemed to have let my subscription to Circuit Fabrication Magazine expire. I am interested in your experience in this area. Is there a way to get a copy of your paper? Could you maybe post it to
Electronics Forum | Thu Jan 04 12:51:37 EST 2007 | Board House
Hi Chunks, Starting copper on outer layer with .0007 is 1/2 oz. copper foil. so if starting copper is .0007 and your Board house will plate an additional .0021 mils of copper. which will give you a finished copper weight of .0028 Mils or (2 oz.) Y
Electronics Forum | Tue Aug 10 09:26:49 EDT 2004 | davef
You should be able to solder to brass - check with you flux supplier to get their recommendations. The flux you are using may not have enough activation to breakdown the oxides on the brass surface. A word of caution - brass (copper and zinc alloy)
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