Electronics Forum: copper wiring (Page 10 of 11)

PCB Finishes Hack Chat

Electronics Forum | Mon Mar 09 15:03:41 EDT 2020 | davef

snip from https://hackaday.com/2020/03/09/pcb-finishes-hack-chat PCB FINISHES HACK CHAT No comments by: Dan Maloney March 9, 2020 Join us on Wednesday, March 11 at noon Pacific for the PCB Finishes Hack Chat [https://hackaday.io/event/169956-pcb-

Re: BGA problem: open after reflow

Electronics Forum | Tue Nov 07 21:49:05 EST 2000 | Dave F

Cheers to you Your gold plating is specified for the gold wire bonding between the die of your BGA and the pads on the BGA substrate. For solderable surfaces this is heavy on gold for use on pads. Gold SB thinner on pads to limit the amount of gol

Re: Closer lead more soldering bridge by using spray flux

Electronics Forum | Tue Jun 08 12:49:41 EDT 1999 | Dave F

| Hi,my master | How to iron out such soldering bridge with below conditions: | 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. | 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB | 3.using spraying fluxer and n

Re: Closer lead more soldering bridge by using spray flux

Electronics Forum | Tue Jun 08 13:06:53 EDT 1999 | Kevin Hussey

| | Hi,my master | | How to iron out such soldering bridge with below conditions: | | 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. | | 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB | | 3.using spraying fl

Oooooh noooooo!!!

Electronics Forum | Tue Jun 08 14:16:49 EDT 1999 | Dave F

| | Hi,my master | | How to iron out such soldering bridge with below conditions: | | 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. | | 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB | | 3.using spraying fl

Cool technology, minimal applications

Electronics Forum | Thu Mar 11 10:31:57 EST 1999 | Justin Medernach

| NASA CommQuest | | | Photopolymerized Conducting Polymers | | Directions: | 1.Please read the information provided on this technology. You may follow the links to additional information resources below. | | 2.After evaluating the technology,

Re: DFM / DFT information

Electronics Forum | Thu Jul 13 22:20:38 EDT 2000 | Dave F

=10 mils larger than lead 3 silk screen legend text weight >=10 mils 4 pads >=15 mils larger than finished hole sizes 5 place through hole components on 50 mil grid 6 no silk screen legend text over vias (if vias not solder masked) or holes 7 so

Need Help for CCGA Rework

Electronics Forum | Tue Nov 01 15:26:43 EST 2005 | GS

Is it this your first experience of C-CGA RWK ? In order to approach a RWK of this kind of pakage it requires a capable process and clear operating procedure. In the past, the company who I use to work for, we rwkd plenty of this kind of CCGA. Earl

10 Methods for PCB Heat Dissipation

Electronics Forum | Mon Oct 26 02:00:36 EDT 2020 | chucherry5076

https://www.jrpanel.com/R The heat generated by electronic equipment causes the internal temperature to rise rapidly. If the heat is not dissipated in time, the equipment will continue to heat up and the components will overheat and fail, resulting

Re: Oooooh noooooo!!!

Electronics Forum | Tue Jun 08 15:04:06 EDT 1999 | JohnW

| | | Hi,my master | | | How to iron out such soldering bridge with below conditions: | | | 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. | | | 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB | | | 3.using s


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