Electronics Forum: corners (Page 10 of 66)

Fine pitch paste release problems.

Electronics Forum | Thu Dec 19 13:10:49 EST 2002 | gramsey

Really? Where does it say that? I have had the opposite experience and 3.2.2 from the IPC-7525 states for square or rectangular apertures - "Having a radiused corner for all apertures can promote stencil cleaning". It actually recommends circular ape

BGA Bowing on the corners.

Electronics Forum | Sun Aug 24 15:00:46 EDT 2003 | Handsome zhang

I am placing a plastic Cypress, 256 pin BGA on a > small assembly, and I cannot stop the corners > from bowing. I've moved my profile up and down > with no results. Any suggestions? Hi mike I am a staff of smt in ASUS(TAIWAN),I have a large in

PCB Expansion (Y & X-axis)

Electronics Forum | Mon Sep 26 10:06:06 EDT 2005 | stepheniii

Make sure the stencil lined up perfectly in the middle all along the width of the board. Everytime someone has told me that a stencil doesn't match the board, they were not critical enough on alignment. Usually they would say one corner is perfect b

Matrix Tray

Electronics Forum | Wed Dec 21 06:47:16 EST 2005 | aj

not sure if I am understanding your question ... If the answer to your question is the following , I think you should book yourself onto a Programming Training Course right away! - the x and y co-ords for a matrix tray is usually determind from the

Lead-Free BGA Rework

Electronics Forum | Tue Jun 26 14:28:50 EDT 2007 | bjrap3

I have been trying to rework a lead-free BGA. For some reason, when I remove the BGA the corner pads on the board come off and the board must be scrapped. If I do manage to remove the BGA successfully, when I solder the BGA, the corners of the BGA

Lead-Free BGA Rework

Electronics Forum | Tue Jun 26 21:36:48 EDT 2007 | davef

While your peak temperature measurement is probably correct, you probably ripped the pads from the board long before reaching that temperature. By using a steep temperature ramp, you are causing the corners of the BGA to curl away from the board and

Problems placing PLCC4 parts with Fuji IP1 - any help/ideas?

Electronics Forum | Thu Oct 16 12:15:40 EDT 2008 | muarty

Is the nozzle used to pick the offending used to pick other parts in this program? Have had experience where the LED's inside the nozzle backlight have broken down causing Vision Processing errors. And worth making sure that the brushes on the head a

No Clean and Underfill

Electronics Forum | Wed Mar 04 22:57:05 EST 2009 | davef

Underfill epoxies may be classified into major groups [Capillary Underfill Manufacturing Development and Characterization for 2nd Level Electronic Interconnect Processes; B Salom�n; University of Puerto Rico, Mayaguez Campus; Dec 2004]: * Capillary.

Vapour phase soldering - problem

Electronics Forum | Thu Aug 20 18:20:21 EDT 2009 | joeherz

Sergey, With that many leads and contact surface area points, it doesn't make sense that the part would move as it has without a gust of wind.... What is your confidence that you don't have an MSD issue on this part. Being that it is a TQFP, it's

Anti scratch film

Electronics Forum | Thu Dec 05 17:59:14 EST 2013 | hegemon

By hand, we apply a precision die cut plastic protective film to a particular "lens" product. It is of the "peel the backing off and apply" style product. Due to the ESD event possibilities, this application is done in an area far away from any ele


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