Electronics Forum: correlation (Page 10 of 13)

Cap Short

Electronics Forum | Mon Nov 22 17:32:34 EST 2004 | davef

Assemblers often assume that the board and component suppliers provide them with clean product. This was not a problem when everyone used water washable fluxes, because the water washing used to clean the flux residues also cleaned the board and com

Urgent!! ... AI process after SMD Reflow Soldering

Electronics Forum | Thu Sep 15 11:28:11 EDT 2005 | LeeHoMa

hi Steve/Pete, Thank for your email to affirming our current mounting and soldering flow! In fact, I also don't see any problem for the pilot run(though in small volume - 500pcs). However, the problem is - I am challenged by my customer that the AI

via under a smd pad ?

Electronics Forum | Fri Nov 23 16:32:05 EST 2007 | davef

There a several things you can do to prevent the solder wicking down the hole with the current design, and that's where you should focus. Cost goes up as you go down the list, but in neither case do you need to respin the board, have solder starvatio

reflow solder joint shear strength

Electronics Forum | Wed Jul 03 15:40:17 EDT 2013 | davef

Shear tests are [in my opinion] senseless. The shear stress you measure depends more on the shear rate and on the point where the force is applied than on the grain structure. When shearing a component, you not only apply shear stress, but also roll

paste quality

Electronics Forum | Mon Feb 10 16:59:57 EST 2014 | hegemon

It is sort of a self answering question if you come in from the solder paste angle. First....start gathering data. Check every day, or every new paste jar, for: Storage conditions (temp), paste expiration date, ambient temp and humidity where yo

BGA Pad with Irregular Pad size

Electronics Forum | Fri Sep 05 06:17:36 EDT 2014 | edriansyah

Hi, We have a problem with our BGA Pad. Our PWB manufacturer make the BGA Pad in irregular form. some big, some small. Please see the picture on attachment. BGA Detail BGA Pitch 0.5 mm BGA Ball 0.3 mm BGA Pad (big) 0.2 mm (as per gerber) BGA

Contract Manufacturer's warranty policy

Electronics Forum | Wed Mar 21 09:31:39 EST 2001 | CAL

Susan - Thank you for providing more information. It is hard just to give a rule of thumb on warranty time. Comparing other contract manufactures is also misleading. I have seen 30 days to 10 year warranties from contract manufacturers. Here are some

Incoming Water Quality

Electronics Forum | Mon Jun 11 22:06:00 EDT 2001 | davef

The issue is not the cleanliness of your in-bound water. The issue is the cleanliness of the board your customer receives. Look at J-STD-001C, Para 8, "Cleanliness Requirements". The end product cleanliness is the end result of your: * In-bound

No Clean

Electronics Forum | Tue Jun 12 18:06:17 EDT 2001 | davef

The criterion you use will depend on the test method you select. For minimum requirements, look at J-STD-001C, Para 8, "Cleanliness Requirements". I figure that you�d measure the residues on a lot of your current product, measure the res on a lot o

Re: X-Ray for CSP devices

Electronics Forum | Tue Jul 20 09:59:22 EDT 1999 | Vikram Butani

Hi Steve, What Earl says is true. You need a stand alone failure analysis/process verification system before you go inline. No matter what brand you choose, it is important to compare a few features, across the board: - X-ray source kV, mA, and f


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