Electronics Forum | Tue May 30 21:12:55 EDT 2000 | Dave F
Madan: You're correct most no-leads require higher temperatures. That makes preheating and temperature monitoring all the more important. Good luck. Dave F
Electronics Forum | Thu Apr 20 12:51:52 EDT 2000 | Robert Patrick
I read your query and reccommend that you take a look at using Infra-red heating technology. I just joined PDR systems and feel that the PDR Technology is appropriate for what you are trying to accomplish. Hope this helps !!
Electronics Forum | Mon Mar 27 10:44:12 EST 2000 | Brian E. Steelglove
Josue, I know KME or Create makes a BP10 for BGA reballing and a BP20 for CSP. The only problem is that these machines are only used overseas so far. Brian Steelglove
Electronics Forum | Sat Mar 03 09:48:27 EST 2001 | ghenning
Considering putting one of these into production. Any comments as to reliability, accuracy, programming ease, etc. greatly appreciated. Targeting small discretes (e.g. 0402), PBGA, CSP, & QFP (to 16 mil) Thanks in advance...
Electronics Forum | Mon Jun 11 21:57:55 EDT 2001 | davef
Go to the IPC website [http://ipc.org] and buy "J-STD-012 - Implementation of Flip Chip & Chip Scale Technology".
Electronics Forum | Sun Jul 15 12:34:15 EDT 2001 | clktsh88
There is a equipment brand : Martin is capable to do you want. In US you may try to approach Manncorp for it. Bye
Electronics Forum | Sun Jul 15 12:34:32 EDT 2001 | clktsh88
There is a equipment brand : Martin is capable to do you want. In US you may try to approach Manncorp for it. Bye Chng LK
Electronics Forum | Sun Jul 15 12:34:43 EDT 2001 | clktsh88
There is a equipment brand : Martin is capable to do you want. In US you may try to approach Manncorp for it. Bye Chng LK
Electronics Forum | Tue Jul 31 20:02:26 EDT 2001 | davef
Search the fine SMTnet Archives, for instance � square and aperture � [http://www.smtnet.com/Forums/index.cfm?fuseaction=search_results&CFApp=1] will get you started on various pitches of uBGA [wid a cuppla CSP thrown in for yucks].
Electronics Forum | Mon Nov 12 06:05:15 EST 2001 | nop_e
Dear all I 'm looking the minimum X-Ray machine capability that is capable to inspect the solder joint of BGAs, Fine pitch BGA and CSP such as open, poor solder joint ,etc... What is the machine specification needed? Thank you for your advise.