Electronics Forum | Tue Jan 03 05:08:50 EST 2006 | Rob
Yes - as they flex less due to their size. I do have the calculations somewhere from my field apps days but it may take some time to find. The problems occuring with the X7R's MU
Electronics Forum | Tue Jan 23 10:22:27 EST 2007 | Peter W.
Hello, maybe you are experiencing the so called "head in pillow" defect. It is especially critical for larger BGA. The defect comes from the deformation during reflow of the BGA, so that some of the balls are lifted and have no contact during liquid
Electronics Forum | Tue Mar 20 00:02:00 EDT 2007 | Darby
Some causes of skewing. If you have exhausted all mechanical problems for that head. Pickup data from tray is incorrect. If you aren't picking up in the exact centre it is possible that the component is being skewed after vision adjustment i.e. cent
Electronics Forum | Fri Feb 01 16:11:08 EST 2008 | operator
They have been having a lot of fallout and they believe it is one of the BGAs that is causing it. I tell all my customers that it is better to stay away from baking if possible and to practice proper storage techniques. But the thing is they insist o
Electronics Forum | Fri May 11 09:56:58 EDT 2012 | cyber_wolf
Paste control is a subject that has a lot of unfounded claims surrounding it. What is the difference in having a "working paste jar" and a "new paste jar" Either way new and old are getting mixed at some point. We just don't buy onto the whole thing
Electronics Forum | Mon May 26 03:27:00 EDT 2014 | julianf
Thanks for your reply Sarason. I'm aware now that my goals seem very ambitious and infeasible. Let me formulate my problem in an different way that might be more realistic. Is it possible to measure a DIFFERENCE in strain between top and middle la
Electronics Forum | Sun Oct 10 17:40:50 EDT 1999 | JohnW
| | | Is there an IPC Standard stating the max. number of times that a PCB can pass through a reflow or wavesolder machine without having solder mask breakdown. | | | | | | PCB is FR4 | | | Solder Mask is LPI | | | Reflow and W/S Profile = Standard
Electronics Forum | Thu Jun 24 23:52:36 EDT 1999 | Dean
| | | Dear guys, | | | | | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We
Electronics Forum | Sun Apr 05 14:57:10 EDT 1998 | Earl Moon
| | | | | We are in the process of deciding whether to change a PCB product from a single board to a 3 up panel array. Could you please advise on the most effective removal design, either scoring or snap off, taking into account that material utili
Electronics Forum | Wed May 14 10:20:37 EDT 2014 | julianf
Hello all! For my mechanical engineering study I want to etch a strain gauge in the Wheatstone bridge configuration in a copper layer of an PCB. The goal is to measure the strain occurring in an PCB even during the press process! We can measure with
