Electronics Forum: dendrite (Page 10 of 11)

Re: adhesive for ptfe boards

Electronics Forum | Mon Oct 04 04:37:57 EDT 1999 | Gian.D

| | | Can someone suggest what material I have to use to protect components by electrical discharge on ptfe based boards? | | | It should have high resistivity, thermal stability (-40 +70 'C),perfect adherence on ptfe... | | | Many tahnks | | | | |

Re: problem when testing the RF product

Electronics Forum | Sun Jun 20 06:30:49 EDT 1999 | Scott Cook

| Do anyone have any experience on assembling high frequency product, 1.8GHz or 2.4GHz. | | In our production line, we manufacture 1.8GHz product with using no clean paste (RMA type) for reflow and no clean wire for rework. In our functinal test,eit

Re: Hand soldering rework fluxes

Electronics Forum | Fri Jan 15 10:52:27 EST 1999 | John

| Hi all, | | I thought I'd use this forum to ask a couple general questions on fluxes for manual operations: | First - Is it OK to use a wave soldering type flux (specifically OA)? Thinking about activation temperatures and the ramp rate of the wav

Re: adhesive for ptfe boards

Electronics Forum | Wed Oct 06 08:49:36 EDT 1999 | Dave F

| | | | Can someone suggest what material I have to use to protect components by electrical discharge on ptfe based boards? | | | | It should have high resistivity, thermal stability (-40 +70 'C),perfect adherence on ptfe... | | | | Many tahnks | |

Re: Process Change

Electronics Forum | Thu Jun 03 12:31:30 EDT 1999 | Dave F

| | | In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We

Re: CSP Assembly- No-clean vs Aqueous

Electronics Forum | Wed Dec 30 17:34:23 EST 1998 | Michael Allen

I'm afraid we don't agree regarding the best test method to use here. My understanding is as follows. The omegameter test measures board-level, ionic contamination (i.e., average for the entire board area and all components); it does not tell you w

adhesive on pads

Electronics Forum | Mon Apr 01 20:10:24 EST 2002 | davef

Oh. [Howabout if I smack you?] If ahma connectin� wif whut yer sayin�, you: * Don�t like the appearance of the glue slobberin� out from under the component even though there is no apparent glue on solderable surfaces. * Concerned about the hydrosco

Re: adhesive for ptfe boards

Electronics Forum | Tue Oct 05 04:23:38 EDT 1999 | Brian

| | | | Can someone suggest what material I have to use to protect components by electrical discharge on ptfe based boards? | | | | It should have high resistivity, thermal stability (-40 +70 'C),perfect adherence on ptfe... | | | | Many tahnks | |

Re: Oven Temperature for Solder Reflow

Electronics Forum | Sat Aug 07 11:33:55 EDT 1999 | JohnW

| | What oven temperature should be used to reflow solder (Sn63Pb37) on a PC board (0.075" to 0.100" thickness) in 5 to 10 minutes? | | Profiling - tedious but important. As said, start with the paste manufacturers recomendation which is usually pu

Re: Process Change

Electronics Forum | Thu Jun 03 14:40:22 EDT 1999 | JohnW

| | | | In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. W


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