Electronics Forum | Tue Jun 23 08:20:03 EDT 2009 | rway
Refer to this article, http://articles.jimtrade.com/1/212.htm The main advantage is of course the density of the board. All the advantages for SMT over PTH are related to the decrease in component size. This is a good selling point for your custom
Electronics Forum | Thu Dec 09 07:21:10 EST 2010 | scottp
You won't have 2 mil height because the solder doesn't remain brick shaped. It's a dome. In the past I tried doing some calculations using the formula for the volume of a spherical section and also tried using a simulation program that accounts for
Electronics Forum | Thu May 31 22:35:23 EDT 2012 | jacktan
I have encountered PCB delam issue with high density PCB. PCB has 42 layers , 5 mm thickness ,laminate material is NelcoN4000-13EP,Tg 210C and Td 350C. Have pre-bake at 125 c for 12 hrs before assy.My reflow temp is standard with 243 peak and TAL is
Electronics Forum | Sun Nov 08 17:04:26 EST 2015 | ttheis
Thank you very much for sharing this information. It is difficult to gain knowledge in this area independently. I'll contact Kester for information on adjusting the flux density and which "thinner" to use since I am using their flux. I really like
Electronics Forum | Fri Nov 25 20:47:54 EST 2016 | sarason
You are coming up against the no of tracks vs density problem. There are basically 2 solutions, more layers so you can get 1 track between each pin as it exits the structure from underneath the IC, say 3 rows of BGA is 2 layers, 5 rows is 4 layers et
Electronics Forum | Thu Jul 06 03:43:22 EDT 2017 | jamesbarnhart
Electronic devices required higher speed, I/O capability, and density to meet standard requirements. Automated robotic soldering solutions that meet the demands of applications are too challenging for hand soldering. Manual soldering, even with the m
Electronics Forum | Fri Feb 28 08:48:00 EST 2020 | SMTA-Joe
We've made the decision to move towards Gold Immersion on our PCBs to eliminate flatness issues with QFNs and BGAs. Land/component pad geometry, population density, and other factors, have made it necessary to ensure a near perfectly flat surface tha
Electronics Forum | Tue Jan 12 10:18:36 EST 1999 | Russ Steiner
| Any idea what the "industry standard" is for fall out on assembled PCB's? I realize that the controls put in place in your processes will effect your overall quality. But I'm trying for a general answer. On pre-tested assemblies, should you exp
Electronics Forum | Thu Apr 28 14:07:24 EDT 2005 | bschreiber
Hello Paul, Prior to 1980, I would say that your concerns were real regarding the resonant frequency. However, since then all major ultrasonic cleaner manufacturers use a "sweep" frequency technology. By "sweeping" or alternating the frequency bet
Electronics Forum | Thu Mar 09 05:44:07 EST 2000 | Wolfgang Busko
Hi Edmund, J-STD-013 "IMPLEMENTATION of BALL GRID ARRAY and other HIGH DENSITY TECHNOLOGY" should be a great help for you. Component manufacturers ( try Motorola via Internet) also give good advice. For the DFM aspects get in contact with your asse
