Electronics Forum | Tue Feb 13 14:39:52 EST 2018 | horchak
Your profile reflow temps are too low. Omnix338 has a melting temp of 217-221C. Your right on the edge, and your soak temps should be closer to 150 than 180C. Bottom line too high a soak, too low a reflow. Take it or leave it.1874
Electronics Forum | Tue Feb 24 14:08:46 EST 2009 | swag
I think you are too hot out of the gate as well as too slow on conveyor. I think settings similar to 130, 140, 150, 160, 230, 240, 260 and conveyor speed at about 28 or 29 IPM would be more realistic but it depends on your paste and oven config/zone
Electronics Forum | Mon Aug 23 14:09:56 EDT 2010 | davef
Similar to Coop's comments, above ... Bridging: * Mis-placement: misplaced components, high placement force mushrooms paste * Too much paste: HASL thickness, lead finish, poor underside support, poor underside wipe frequency, printing with too lar
Electronics Forum | Wed Feb 25 21:37:12 EST 2015 | dinhhuunam
Hi Bartel , 1.1 Profile Solution to Cold Soldering Cause for Cold soldering The peak temp of reflow is too low. The preheating temp is too high and it takes too long Solution Lower the preheating temp and increase the peak temp in the reflow zone
Electronics Forum | Fri Feb 07 15:16:46 EST 2003 | Claude_Couture
Bulk parts cassettes... another idea that must have looked good at the time. Too bad the manufacturing trend went from low mix / high volume to high mix / low volume. I guess the feeders have to be too complex to feed the part properly to the machine
Electronics Forum | Mon Jun 23 04:00:43 EDT 2003 | Paul Cooper
Hi there There are a number of things worth considering when viewing bga's. Firstly, like any other solder joint that you have been inspecting for years, suface finish is critical. Secondly, and again like other joints shape is important. Now it may
Electronics Forum | Tue Jan 11 11:50:35 EST 2005 | Shean Dalton
Consider these three potential causes: 1) too much sludge - if the sludge builds up around or over the temperature sensor, then the sensor does not get an accurate reading. 2) too much chemistry in the evaporation solution - Check the temperature a
Electronics Forum | Fri May 30 04:20:59 EDT 2003 | Ben
Hi all I am facing the problem with reoworking CSP component for high frequency application boards. Our customer do not allow us to use tacky fluxes due to high frequency application and component has low standoff ,and the ball pad and ball size is
Electronics Forum | Tue Jun 05 03:56:52 EDT 2001 | JohnW
Flip Chip/uBGA Underfill Visual Standards The aim of this document is to produce some draft text and then select photographs to make up a draft visual standard for inspection. There is also a need to produce some reference material for C Scan image
Electronics Forum | Fri Aug 13 09:09:11 EDT 2004 | davef
Solderability standards are: * IPC EIA J-STD-002B - Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires * IPC EIA J-STD-003A - Solderability Tests for Printed Boards Not intending to insult you, but terms used to descr