Electronics Forum | Wed Sep 29 04:33:35 EDT 1999 | Earl Moon
| | Hi All, | | Any one experince BGA-chipset warp about 10-15mil after removing | | from PCB? | | FYI, the rework temperature for preheat was 170C from room | | temperature about 30 seconds, & BGA was removed at temperature | | between 190-200C.
Electronics Forum | Mon Sep 13 04:17:10 EDT 1999 | Earl Moon
| I noticed that some of our pcb's component legend/designation are unreadable as they are placed under smt pads. Is this correct and according to standard? Although we don't have any problems with them as of now, I would like to know the effects on
Electronics Forum | Fri Sep 06 11:16:08 EDT 2002 | dason_c
To check any solder crack, open under the BGA/CCGA. I am using a destruction test to find out is it related to the reflow profile or the Fab issue. 1. Depense the Dye (I use Dykem Steel Red) under the device. 2. Cure the dye 3. Remove the device 4.
Electronics Forum | Thu May 08 21:13:59 EDT 2008 | davef
Glennbrook Technologies Cautionary Note on the Use of Geiger-Mueller Tube Devices: These are inexpensive radiation monitoring devices and it is possible, when they are calibrated to a Cesium-137 standard (at 600 keV), for the meter to read higher tha
Electronics Forum | Sun Apr 25 11:18:45 EDT 1999 | Earl Moon
| Hello all, | | Been doing some comparisons on joints made using the soldering iron versus reflowed solder paste (on a QFP package). The difference is quite significant: the joints made by the soldering iron are inconsistent and in many cases not
Electronics Forum | Tue Feb 15 13:47:59 EST 2000 | Stu Leech
We have just completed a test for a leading manufacturer of SMT IC packages. There were some surprises. The carrier and cover tapes appear to be highly hygoscopic. The saturation curves for the tape and devices showed dramatic absorption at the begin
Electronics Forum | Thu May 07 20:28:35 EDT 2009 | davef
From our notes, the following is a series of snips from: "Copper Dissolution in Tin" LJ Turbini, PhD, adjunct faculty member, University of Toronto, Materials Science and Engineering, SMT 2/07 As the solder becomes molten, copper from the board diff
Electronics Forum | Tue Jul 14 07:37:31 EDT 2009 | tony_d
Hello Reese, We currently own two MIRTEC MV-3 desktop machines and one MV-7 inline machine (so you can tell right away that I am a little biased.) We had an opportunity to evaluate both the YESTech and MIRTEC machines on our production floor. The
Electronics Forum | Wed Jul 22 12:47:23 EDT 1998 | Earl Moon
| I'm trying to put together a set of design guides for use for new designers | in house or to be sent out for contracted layout work. I would like to start with a top ten list of things that will go wrong if rules aren't available. For example testp
Electronics Forum | Fri May 15 18:09:00 EDT 1998 | Earl Moon
| | | We understand that testing for ionic contamination and surface insulation resistance measure different properties. We assemble printed circuit boards for other companies. We will not get combs on 90% of the boards that we assemble. | | | We h