Electronics Forum | Tue Feb 29 14:10:09 EST 2000 | Glenn Robertson
Steve - I believe you should ask who has NOT dealt with this before. Search the archives for "dark pad" or "black pad". It's a common problem for immersion Gold. Does anyone Know any other descriptive names that I missed (and can be printed
Electronics Forum | Tue Feb 29 14:10:09 EST 2000 | Glenn Robertson
Steve - I believe you should ask who has NOT dealt with this before. Search the archives for "dark pad" or "black pad". It's a common problem for immersion Gold. Does anyone Know any other descriptive names that I missed (and can be printed
Electronics Forum | Sat Jun 26 14:15:28 EDT 2004 | PCA
Does any one have the best recommendation for a water soluble solder paste for use with fine pitch parts and micro BGA's and immersion gold pads.
Electronics Forum | Tue May 11 08:20:52 EDT 2021 | jineshjpr
Hi Anyone having IPC 4552 A ?? Can You please provide the details of Immersion Gold Thickness Recommendations mentioned in Page 21 & Additional details required for Immersion Gold Thicker Than Specification by Design mentioned in page 23.
Electronics Forum | Wed Oct 24 18:08:02 EDT 2001 | davef
1- DF1: WOW!!! How do people get these cool toys? CB: I am with the University at Buffalo Electronic Packaging Lab. http://www.packaging.buffalo.edu We have pretty much everything that is sold on the market as well as Laser inspection technologies we
Electronics Forum | Tue Jul 15 16:30:57 EDT 2008 | boardhouse
Hi Aj, Recommended Immersion gold thickness would be 3-5 Micro inches over 140 -200 micro inches of Nickel. Thicker Immersion gold than 5 micro inches can cause solder joint embrittlement. Gold readily dissolves in molten solder and will be present
Electronics Forum | Wed Mar 11 11:05:06 EST 1998 | Earl Moon
| I am having a problem with Entek coated boards. The solder past seem to just ball up on the pads. I had no problems with the board when it was hot air leveled. The board is double sided surface mount. I have tried adjusting the oven profiles mak
Electronics Forum | Sun Mar 15 23:58:01 EST 1998 | Phill Hunter
| | I am having a problem with Entek coated boards. The solder past seem to just ball up on the pads. I had no problems with the board when it was hot air leveled. The board is double sided surface mount. I have tried adjusting the oven profiles m
Electronics Forum | Thu Feb 19 12:35:13 EST 1998 | Earl Moon
| | We are currently investigating alternatives to HASL for circuit boards with 20 mil pitch smt pads and below. If you have experience with this product or simular immersion tin products with respect to manufacturing or assembly I am very interest
Electronics Forum | Sat Mar 15 09:30:29 EDT 2008 | davef
Unlike other solderability protection, immersion coatings [eg, ImAg, ImSn, OSP, etc] can be reworked by the board fabricator prior to assembly operations. Reasons for selecting immersion are: * Until a supplier can demonstrate that they can turn bla
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