Electronics Forum | Wed Jul 06 08:32:11 EDT 2005 | aj
Doug, Why not insist on the smae fromat from all customers. They can export center cad-data as easy as any other type. Do you send a DFM to your customers? If you tell them that it will improve your turn around time they will send you what you wan
Electronics Forum | Tue May 16 14:05:44 EDT 2006 | Mike
Hello, Heres my take. If the ends that are touching are connected by trace, and IPC-610 is satisfied, and the connection does not make a Parallel circuit where a series circuit is required, then I would treat it as a process indicator. That is, unle
Electronics Forum | Wed Jun 28 21:50:18 EDT 2006 | adihsr
BGA is better- in terms of 1.0 no bent leads or coplanarity problems 2.0 self align on solder pads 3. easy solder printing 4. large pitch ...I think those who goes for QFP have not had a strong SMT experience. Do not be hurt byt this is a basic SMT D
Electronics Forum | Mon Jul 30 14:23:04 EDT 2007 | davef
So, now you know the tolerance that you and the board fab have in the area of the score line. For more, look at: * Accusystems [accusystemscorp.com] site scoring section for their FAQ. * Merix [Merix.com]: Designing For Manufacturability (DFM) Manua
Electronics Forum | Fri Sep 21 11:51:44 EDT 2007 | chef
To clarify my comment regarding test points- I mentioned that fact as I knew we would need to develop test beds that may be more difficult due to test points not easily provided. Beyond that, my goal is to begin DFM with my customers that would inclu
Electronics Forum | Fri Nov 09 10:15:27 EST 2007 | devajj
Of course if you are an OEM you could go back to your design engineers and tell them via's in SMD pads is unacceptable. Put that in your DFM design guidelines. If you are an EMS provider you can also influence your customer by explaining the impa
Electronics Forum | Fri May 01 06:49:31 EDT 2009 | davef
minimum space between selective wave soldering pallet's opening to the nearest PTH or SMT pad? * http://www.agicorp.com/pdf_files/Designguidelines903.pdf * http://www.datumdynamics.com/resources/dfm_wavesolder.html?PHPSESSID=a73b3bc8bbd55519bffbb68
Electronics Forum | Fri Apr 27 08:19:04 EDT 2012 | jim_n_hky
Can anyone offer guidelines on DFM and process recommendations for soldering .050" pitch connectors in the wave. The initail design had .026" drill with .043" pads so only .007" between pads. I requested .035" pads, but this still only leaves .015" b
Electronics Forum | Thu May 17 03:23:44 EDT 2018 | shuhaib
the D-PACK IC are falling down in primary side while second side reflow soldering. the solder paste volume is ok. reflow time ( TAL ) is less than primary side. but still issue is happening. let me konw how to prove it is DFM issue, because its hea
Electronics Forum | Fri May 11 20:55:51 EDT 2018 | jlawson
Rehm Thermal Systems (Germany)offer in process vacuum reflow in convection ovens and vapor phase pending what makes sense - volumes of PCB per hour needed. There are other vendors getting into this of course. Can only get single digit void free join
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