Electronics Forum | Fri Jan 17 18:13:02 EST 2003 | MA/NY DDave
Hi I probably shouldn't say, Yet unless you are big or have some reoccuring kind of work with the government or ??, I wouldn't use the EMPF DaveF listed. They are now really the ACI (American Competitive Institute) and are not really the old EMPF
Electronics Forum | Wed Dec 06 20:19:24 EST 2000 | Michael Parker
Ralph- Good thing you found this website so early on in your CM worklife. I am guessing you knew the job was dangerous when you took it. Be sure to refer back here daily, you will learn a mountain of things in a short time. The library also has a va
Electronics Forum | Wed May 03 20:10:57 EDT 2000 | Dave F
Erhard: Several companies make feeders that move leadless chip components from a bulk feeder carrier, line them up head-to-tail, and present them to the pickup head of a high speed placement machine. Try: * Panasert * Suzuki � but you probably a
Electronics Forum | Mon Feb 07 13:20:03 EST 2000 | Dave F
Graham STOP!!! You can not be totally serious. A five year old cost model counts bean, and beans are beans. I have to know more about the calculation. If this bores some of your gear-heads, click on "return." � Help me with the terms: - "Ops cos
Electronics Forum | Mon Jan 25 21:14:08 EST 1999 | Dave F
| Greetings, | | We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? | What about those components which come on blister tape, should they get baked and r
Electronics Forum | Fri Jan 15 14:49:32 EST 1999 | Dave F
| Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then proce
Electronics Forum | Wed Jan 20 20:01:27 EST 1999 | Tony Arteaga
| | Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then pro
Electronics Forum | Fri Jan 08 19:47:55 EST 1999 | Kwang-Seong Choi
| | HI! I am a package engineer in Korea. I have some reasons | | to desolder excessive solder at the lead of TSOP and TSOJ | | after removing them from the board. The way with solder wick is too time-consuming and depends on the operator. | | Does
Electronics Forum | Thu Jul 09 21:04:50 EDT 1998 | Dave F
| Hi there, | I am looking for some informations concerning the shear or pull strength of a typical TQFP 20 mils leads in relationship with the Copper/Tin intermetalic layer thickness. Could anyone help? | | Thank in advandce. | rgs, | chiakl Chiakl
Electronics Forum | Mon Feb 23 16:59:43 EST 1998 | Doug Romm
Dave, "Paladium Pillows and Bad Dreams"....that's a good one! I've been doing this for the last 9 years and I've heard quite a bit, but that's really cute! Seriously, in reference to the 'pillow effect' when the lead looks like it is "sitting" on to