Electronics Forum | Mon Mar 30 16:29:31 EST 1998 | Tony Arteaga
| | Can anyone give me any info on the effective removal of BGA's? I need to be able to take a variety of BGA's off boards quickly without creating pad damage. I am not yet concerned about the re-attach process. | Depending on your rework station,| U
Electronics Forum | Sun Jan 25 10:39:55 EST 1998 | Rich Breault
| Does anyone have any information on reballing BGA devices? | I'm looking for specs, a process flow, and what tests | should be performed afterward. | Also, I'm looking for any companies that contract this | service. | Thanks. Hello Allan, We at NET
Electronics Forum | Sun Jan 25 10:39:52 EST 1998 | Rich Breault
| Does anyone have any information on reballing BGA devices? | I'm looking for specs, a process flow, and what tests | should be performed afterward. | Also, I'm looking for any companies that contract this | service. | Thanks. Hello Allan, We at NET
Electronics Forum | Thu Sep 14 13:34:43 EDT 2000 | Boca
Of course the others have great answers, try NOT to do it, for all of their reasons. However, had to do it in the past, OEM, custom chip, die wouldn't fit in a SM package, volume wouldn't support a second package type ...... and on and on. So we us
Electronics Forum | Thu Jun 13 06:08:57 EDT 2002 | edahi
guys thanks for the suggestions... DaveF, *Changing paste EricD: Yes we are considering that as a point. Because I believe the paste we are using are in syringe packaged and designed for dispensing. We are using an Indium SMQ75 paste and current
Electronics Forum | Mon Jan 03 14:00:06 EST 2000 | John Anderson
Has anyone had luck with 0201 cap board design, solder printing and reflow? IPC-SM-782 does not provide much help. I am particularly interested in attach pad design, stencil aperture design and thickness, solder paste (mesh, metal content, etc.), and
Electronics Forum | Fri Jan 04 06:28:27 EST 2019 | ameenullakhan
Hi, We are observing solder joint discoloration ( yellow color appearance ) in one of assembly after secondary reflow run. Please provide your valuable feedback. Solder paste : water soluble lead free Alloy : SAC305 Flux : ORM1. Please provide v
Electronics Forum | Thu Nov 13 12:32:12 EST 2014 | jorge_quijano
Hola, I've used the free e-book that I'm attaching when I implement the first Pin in Paste process, it was helpful. http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=17555&mc=10 One thing that was helpful was also th
Electronics Forum | Fri Aug 10 19:49:32 EDT 2001 | nifhail
What would be the best method for attaching the balls, when doing BGA rework. I Found that by using the solder paste, it will give us better rework yield vs using the paste flux ? My data was collected from a very small experiment and hard to conclud
Electronics Forum | Thu Feb 01 05:06:46 EST 2018 | ameenullakhan
Hi Rob, Thanks for your reply. Our customer don't need any pin hole in his board. Attached is the image for your reference. The issue is minimized for us with hot profile ( 80 - 100 sec in between 170 to 180 deg C ) For leaded paste. Lead free pa
