Electronics Forum | Fri Aug 22 00:20:29 EDT 2008 | rameshr
Hai, In our process we are using the micro bga of size 13X13mm of pitch 0.45mm,after soldering process the bga found collapsed, we absorbed that the PCB land pattern of the BGA was not in array, uneven distribution of pads (area) & most of the pads
Electronics Forum | Wed Dec 10 16:15:24 EST 2008 | terryl
on the front end in design, minimize the pth connections to ground planes. this takes alot of work by the pcb designer and the approval of the design engineer. connect maximum of 4 ground planes to pth, minimum 1 plane. use spoked connections. ev
Electronics Forum | Thu Jul 09 00:15:39 EDT 2009 | jan_mancelita
Hi, do you know where and how we can tests 0402 ceramic capacitors? We would like to test them individually before we place them on our board; so as to get some test yield and the distribution of the parameters of this component based on the publish
Electronics Forum | Tue Feb 09 08:48:29 EST 2010 | davemacnemo
Machine has 2 FlexJets installed. Working fine until it started giving Theta1 following errors. Machine will not zero. Coincidental (I think) with this, the Low Power Power Supply behind the Power Distribution Panel failed and was rebuilt. It's worki
Electronics Forum | Wed Sep 01 08:25:31 EDT 2010 | sachu_70
Tombstoning is a result of imbalanced force experiences by the device during reflow due to unequal behavious of the solder paste across all sides of the device. Could be due to many factors a few of this are: (1) Unequal solder mass distribution, (2)
Electronics Forum | Mon Jan 21 09:29:33 EST 2013 | cnotebaert
I agree, you will likely need a carrier being that thin. without seeing the trace layout I’m not sure about relieving the carrier to accommodate them. if evenly distributed you shouldn’t to go that far. Are parts on both sides of the board? Don’t mak
Electronics Forum | Tue Nov 24 13:37:27 EST 2015 | ttheis
A shot of the screen is attached showing the version information. Where do I find the filters? It looks like the power goes from the switch to the large power distribution box which I presume has the back-up batteries inside. What method is recomme
Electronics Forum | Thu Apr 20 02:44:39 EDT 2017 | tsvetan
The hole is too big, you should reduce the size in the next PCB revision. The middle joint is soldered at low temperature you can see how the solder didn't distributed evently and cooled on waves. The solder joint at the bottom didn't wet the capac
Electronics Forum | Tue Sep 24 18:38:54 EDT 2019 | researchmfg
Well, there may be a misunderstanding that people think the IMC layer grows the thicker the more strong soldering strength. Actually, the IMC layer can be grown and distributed evenly at the interface between Cu-based, Ni-based and Sn-solder will be
Electronics Forum | Tue Dec 22 15:10:57 EST 2020 | ilavu
Tom, There are two power supply in the machine. One on top of VME box and other behind power distribution panel. The voltage that you see and check at PDP is not from VME.
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