Electronics Forum | Fri Mar 02 09:08:25 EST 2007 | samir
There is a formula that determines whether a component will fall off during a 2nd reflow. It takes into account the grams (weight) of the component and the total surface area of the solder joints. I don't know this off the top of my head, but it's
Electronics Forum | Thu Mar 01 19:38:12 EST 2007 | Wayne
1) run the BGA side first. set the bottom temp lower (if your reflow oven have top and bottom temp setting) for connector side while doing your 2nd reflow. 2) run the BGA side first with your normal leadfree paste, and run the connector side with low
Electronics Forum | Fri Feb 23 15:31:31 EST 2007 | realchunks
Running the BGA first is OK. We run double sided BGA baords all the time without problem.
Electronics Forum | Fri Mar 02 17:56:17 EST 2007 | davef
Samir's correct. We've talked about this previously. Search the fine SMTnet Archives for those discussions, like http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=23236
Electronics Forum | Thu Mar 01 00:27:58 EST 2007 | Muhammad Haris
Hi, I believe ,do the BGA side first and then use glue from dispensor for the connector side. THIS CONDITION CAN BE FOLLOWED IF & ONLY IF UR CONNECTORS DO NOT BURN OR LOOSE THEIR PHYSICAL STATES. OR SIMPLY REDESIGN THE
Electronics Forum | Thu Mar 01 00:29:08 EST 2007 | Muhammad Haris
Hi, I believe ,do the BGA side first and then use glue from dispensor for the connector side. THIS CONDITION CAN BE FOLLOWED IF & ONLY IF UR CONNECTORS DO NOT BURN OR LOOSE THEIR PHYSICAL STATES. OR SIMPLY REDESIGN THE
Electronics Forum | Thu Mar 01 12:40:55 EST 2007 | james
We are using lead paste on both sides, the only reason we need to change the profile is because the BGA is lead free. I decided to run the BGA side first, then the connector side. This way I am not running both sides through on a hotter profile.
Electronics Forum | Fri Mar 02 14:43:28 EST 2007 | stimpk
Are you using lead free paste also? Are all the other parts on side 1 ROHOS ? etc.. can they handle your leadfree profile. Those need answered 1st. But to answer your question. Yes you can run the BGA side 1st ( hopefully with leadfree paste and ho
Electronics Forum | Fri Feb 23 15:14:51 EST 2007 | James
I have this board that we are currently having problems with. When we run the BGA side with the hotter temp. the connectors on the other side lift off their pads. The BGA is lead free, that is why we have to use the hotter profile. Would it be
Electronics Forum | Thu Mar 01 12:08:33 EST 2007 | rob_thomas
It sounds like something is a little off here. ROHS compatible and ROHS capable parts are going to be ok with a leaded solder paste and processing unless you are building high reliability product.( some are going to argue that even high rel products
