Electronics Forum | Wed Dec 06 16:48:42 EST 2006 | Mario Scalzo
I would be glad to help you eliminate the solder balling and beading that you are seeing. As this is a fairly common defect, I would like to forward you an Application Note that we have developed that explains the cause and possible solutions. Most
Electronics Forum | Mon Mar 02 23:48:22 EST 2015 | vb7007
Hi We are using Universal carrier for a 2 sided PCB, where the bottom side goes for hand solder the switches after wave. Our issue is, we are getting micro solder balls all over PCB bottom after wave, whereas we got numerous vias, which also turns
Electronics Forum | Tue Mar 03 09:29:48 EST 2015 | rgduval
A couple of things that have helped me with solder ball issues at wave in the past: 1. Flux. Insure good flux coverage on the bottom of the board. 2. Preheat. Insure that the board is sufficiently preheated for the wave operation. Since you're
Electronics Forum | Fri Aug 03 21:54:48 EDT 2001 | jbull
Steve, I will assume from the eloquently worded press release you are an employee of Tyco Electronics. Let me start off by saying welcome to the SMT neighborhood, we will be looking forward to the new options your company will provide us. One thing
Electronics Forum | Tue Dec 16 14:48:03 EST 1997 | Justin Medernach
| Q1. | As part of a Final Year Thesis I am currently undergoing an in-deph study of the Screenprinting process for MPM 3000 Screenprinters. | Ultimately I will be setting up control charts on line. | Does anybody have suggestions in this area ?, I h
Electronics Forum | Thu Oct 17 17:18:48 EDT 2002 | Leandro G. Barajas
Hi everybody, This is a simple posting to initiate a discussion on different ways to troubleshoot, improve, and control the Stencil Printing Process SPP in SMT manufacturing. There are many SPC, ANOVA and other analysis techniques that provide insi
Electronics Forum | Mon Oct 28 09:48:10 EST 2002 | gregp
If I understand correctly you want to pick BGAs from the ball side using some type of vacuum arrangement. You will find that the reliability of this is dependant on the size of the balls and the pitch. The larger the balls and tighter the pitch, th
Electronics Forum | Thu May 29 17:48:00 EDT 2003 | jonfox
As far as I know, the limitations apply to to the manufacturing components, not the equipment per say. At this point there is no set date for the US at the national level. Basically our government is run by big businesses and their effect on our na
Electronics Forum | Fri Jan 30 10:29:48 EST 2009 | petep
We have a potential new customer who has special PCB requirements. I do not know a lot of details at this point, but have several questions. One of their assemblies has within it , a MID, Solid foil layer, completely isolating one side of the PCB f
Electronics Forum | Tue Dec 05 15:10:55 EST 2000 | Francois Monette
Victor, here are a few more elements of information to answer your question. Both the temperature and relative humidity on the manufacturing floor have a significant impact relative to the rate of diffusion of moisture inside a plastic package and t
