Electronics Forum | Thu Jun 13 08:46:20 EDT 2013 | markhoch
It sounds like they are referring to Low-Pressure molding, which was designed specifically to encapsulate electronics. I have seen some products that were processed on polymide flex, and then overmolded in this process. I would start by contacting "
Electronics Forum | Wed Oct 04 00:47:57 EDT 2017 | silversurfer11
Hello, I am experiencing a high pitched noise coming from a computer component and I think it might be the 18 inductors they have placed on the PCB as part of the VRM. I am think of using a 2 part Thermal Conductive Adhesive and fix all the inducto
Electronics Forum | Thu Jan 14 22:59:08 EST 1999 | Chris G.
I get white residue on my PCBs after vapor degreasing. No comments on the vapor degreaser. Yes, I still use one of these. I use a vapor degreaser and a 1,1,1 replacement solvent due to the quick clean and quick dry times. Anyway, I only get white
Electronics Forum | Mon Jan 18 21:05:15 EST 1999 | Dave F
| I get white residue on my PCBs after vapor degreasing. No comments on the vapor degreaser. Yes, I still use one of these. I use a vapor degreaser and a 1,1,1 replacement solvent due to the quick clean and quick dry times. Anyway, I only get whi
Electronics Forum | Sun Aug 29 19:17:34 EDT 2004 | aqueous
Chen, It is always best to place one�s effort on determining the cause and content of the residue rather than trying to work around it. The first thing you must determine is the nature of the residue. Is it flux? In many instances, the residue is
Electronics Forum | Sun May 21 09:38:25 EDT 2006 | davef
Epoxy Removal and IC Delidding [Hardware Hacking: Have Fun While Voiding Your Warranty, Chapter 14] Encapsulation of critical components using epoxy or other adhesives is commonly done to prevent tampering and device access (the microprocessor shown
Electronics Forum | Mon Aug 21 12:08:36 EDT 2000 | Dason C
Hi! I had experience with my customer complain about the delamination on BGA. The first question, I will ask my customer how they removed the parts and de-cap (my customer is using de-cap instead of SEM, I prefer SEM). Most of the customer which I
Electronics Forum | Wed Apr 05 13:59:56 EDT 2000 | Kal C.
Hi Emmanuel, There is lots of info. in SMTNet archive (I think 98 Sept-Dec). I had a lot of problem with PBGA and certain uBGA with their PCB base material (FR-X) and encapsulant. Wolfgang is correct. We had to reprofile our reflow oven , qualify an
Electronics Forum | Thu Mar 16 10:41:34 EST 2000 | Russ
Are we talking midship SMT or wave soldering? SMT - I have found the best method is not having them (WOW) this can be accomplished through pad design, aperture design, placement accuracy, and profiling, It is my understanding however, that these
Electronics Forum | Wed Jan 13 15:43:00 EST 1999 | Dave F
| How is everybody? | | I was asked about any problems that would be associated with having a plastic casing injection molded around an assembled PCB. I am not sure if injection molded plastic has to be hot, I am assuming so (can they use epoxi
