Electronics Forum | Fri May 28 13:19:31 EDT 2021 | cbart
I can't see the image very well, but from what i see it looks like oxidation. looks like an ENIG finish on the board, possibly a plating issue from the bare board house, thin gold or the nickle is to thick. one other question i would get an answer t
Electronics Forum | Mon Aug 16 16:37:08 EDT 2004 | davef
As we mentioned in an earlier response in this thread [Q5], you do NOT want to solder to hard gold. Hard gold is a wear surface. [That's IT, that's the LIST.] If you want to solder to gold, then either use: * IPC-4552 ENIG specification, mentioned
Electronics Forum | Fri Jun 09 12:51:52 EDT 2006 | flipit
You can not solder to 30 micro inches of gold over nickel and certainly not 80 microns. You can not with tin lead solder or SAC305 anyway. The upper limit is between 6 and 10 micro inches of gold. This is what ENIG plates to. If you solder to gre
Electronics Forum | Fri Jul 18 10:46:43 EDT 2003 | davef
If you are saying that you have discolored white tin at in-bound inspection, you have bad boards. The boards are fabricated incorrectly. Your fabricator is deficient. That is the GREAT thing about imm coatings. You can look at them and determine
Electronics Forum | Wed Dec 22 01:39:06 EST 2010 | boardhouse
Hi Johan, As a Asian board supplier - I would not recommend using Lead free hasl on any product that has BGA, you would be just looking for issues, flatness being the main. I agree with one of the other replies - Your purchasing dept. should not be
Electronics Forum | Wed Jan 13 04:27:00 EST 2016 | crystalpcb
Hi Here is our factory production capability: Shenze Electronic PCB Specification Layer Count 1 to 35 Layers Material Brand Shengyi,KB,GRACE,ISOLA,Rogers,Taconic,ARLLON,Bergquist Base Material FR-4（TG135,TG150,TG170,TG180），Halogen Free FR-4，Ceramic
Electronics Forum | Tue Jan 15 06:05:37 EST 2002 | Romain
Dear all We have since few weeks problems with BGA solder joint integrity on ENIG finish. Under relatively very flexible of the FR4, the joint breaks between ball and PWB. When we take off the BGA for analysis, some of the pads seem very flat, totaly
Electronics Forum | Mon Oct 25 17:50:46 EDT 2004 | Mike
I work for a PCB Manufacture and I am looking for info on BGA Pull test or strenght test. I have a CM that is experiencing bga's with some weak joints. they are telling me that when they do their pull test the joints are breaking at the nickel inste
Electronics Forum | Sun Feb 27 17:06:18 EST 2005 | Darby
This is the profile we came up with on a 1500 to satisfy the parameters suggested by Indium. This was on an FR4 1mm thick 4 layer pcb that I would descrbe as medium density, QFP, SOP, AL-CAP, TANTS, D-PAK, MINI SPRING COIL, SOT and CHIPS were all use
Electronics Forum | Thu Mar 24 07:06:06 EST 2005 | davef
There's a lot of comparison tables on the web. Here's one: Properties - Summary [A Winlow Circatex] Attribute||Hasl||Immersion Silver||Immersion Tin||Electroless Pd||OSP||Eless Ni / Imm Au Shelf Life (months)||12||12||12||12||12||6 Multiple Reflows
