Electronics Forum: epoxy and void (Page 10 of 14)

Re: 2 questions: via tenting and annular ring terminology.

Electronics Forum | Wed Jul 07 13:41:42 EDT 1999 | Dave F

snip | | If you go for plugging be sure you have a protrusion spec that you can live with. This often results in little bumps of epoxy that can interfere with component placement. For us, tenting .015 vias usually gets us about 80% coverage from

IPC Class 3 Annular Ring and Fine Pitch BGA Challenges

Electronics Forum | Fri Sep 08 21:49:24 EDT 2017 | sbar5781

Hello, I have a few PCB boards i am trying to be manufactured that are miniaturized medical devices. Thus they require IPC Class 3 Specs. However as miniature devices they have limited space, including a 0.4mm pitch BGA socket, which currently has

Re: The care and feeding of adhesive nozzles

Electronics Forum | Wed May 26 10:00:03 EDT 1999 | David Scott

| | | | | | | | | | | | Any suggestions on how to maintain Adhesive dispensing nozzles??? They seem to plug up over night and it is starting to get on my nerves. We have tried leaving the nozzles in the machine, removing them and soaking in alcoh

Re: Farewell to fellow old-timers and up-and-comers alike

Electronics Forum | Thu Feb 17 09:49:02 EST 2000 | JAX

Although I hate to see anyone leave I cannot help but feel that the forum will benifit from it. Once you no longer look at the forum as simply a medium to carry out your technical discussions and start thinking of it as a way to benifit yourself, the

Re: Farewell to fellow old-timers and up-and-comers alike

Electronics Forum | Thu Feb 17 09:49:02 EST 2000 | JAX

Although I hate to see anyone leave I cannot help but feel that the forum will benifit from it. Once you no longer look at the forum as simply a medium to carry out your technical discussions and start thinking of it as a way to benifit yourself, the

Re: 2 questions: via tenting and annular ring terminology.

Electronics Forum | Wed Jul 07 00:28:59 EDT 1999 | Scott Cook

| Q #1) Is it more reliable to have the mask tent over the vias or risk getting vias half filled with solder? These are vias with an .020" hole and .040" or .050" pad. John, It depends......mainly on the via size. Tenting works on smaller vias. Tent

Re: Pin Hole/Blow Hole - Causes and cure please

Electronics Forum | Thu Jun 24 10:48:02 EDT 1999 | Earl Moon

| Recently, there has been an upsurge in the Pin Hole/Blow Hole problem in our wave soldering process. We are baking the PCBs for 2 Hrs. at 125 degree C. The Wave Soldering profile seems to be O.K. Still the problem is persistent. Can somebody hel

Pick and Place Startup - LQPF100 bridging issues

Electronics Forum | Thu Apr 29 10:24:15 EDT 2021 | oxygensmd

I have the same issue but with one customer only. All the other have smaller or more difficult QFPs with really low bridging issues - close to no-one. I think the PCB and PCB design also an issue - other customers are using 32/64/100/144 QFPs and we

Re: Adhesive Dispenser Vs. Screen Printing Adhesives Pros and Cons

Electronics Forum | Thu Oct 12 22:16:59 EDT 2000 | Dreamsniper

Hi Guys, I'd like to share this to all of you...you can start playing with the rests...Stated prices, if not indicated, are in Aussie $ or Singapore $. Stencil Printing Adhesive Pros a) Less Capital Equipment Cost (Short Term). In reality it is f

How to Differentiate Class 3 and Class 2 products in terms of process

Electronics Forum | Mon Jan 12 21:31:26 EST 2015 | warwolf

The closer your inspection the more defects you will find, the more rework you do the possible cost you will add and the potential increase of damage you could do to your products if rework is not up to a machine copyable standard. "Is there any in


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