Electronics Forum | Tue Nov 16 06:52:44 EST 2010 | cacace
1 um". Some PCB manufacturer is telling me that this specification is not feasible in production. I would know if this position is due to the equipment (or process control) they have, or if in effect is not possible to satisfy my requests.
Electronics Forum | Tue Aug 29 17:05:00 EDT 2000 | Travis Slaughter
There are a large number of variables that determine how many tabs are needed. The biggest ones I can think of, off the top of my head are. Board thickness .031 needs more than .093 Process and equipment used in assembly some processes and equipment
Electronics Forum | Thu Mar 11 17:33:01 EST 1999 | Scott
Kester is no longer in the equipment business. Robotic Process Systems (the orginal maker) is now selling and servicing the Micro wetting balances, Steam agers, and dip and look testers
Electronics Forum | Thu Sep 02 11:45:47 EDT 2010 | kevm
We have tried solderability testing using an agressive flux and have had good results. However, our Mfg process uses laser soldering equipment which is a validated process and we are limited on the type and amount of flux we can use due to ionic cont
Electronics Forum | Wed Feb 09 08:27:09 EST 2000 | Gary Fountain
I'm looking for information on networking, processing and displaying data from SMT equipment.
Electronics Forum | Wed Aug 22 17:39:19 EDT 2007 | K
I was wondering if there is anyone out there who is soldering the Luxeon Lumiled LEDs into product. We are working on a product that uses them. They are a challenge in that the are SMT parts, but will not withstand reflow temperatures. The manufact
Electronics Forum | Tue Sep 21 10:50:21 EDT 2004 | Andy
We are in the same position like you. We are in a tug-of-war with our QA with regards to this process. Their reason is that the machine is used for quality purposes which is to verify BGA solder quality so it must be under Quality. From my experience
Electronics Forum | Tue Jul 08 20:24:26 EDT 2003 | davef
AlCapone: Consider determining the responsible party according to their ability to deal with the complexity of collecting and analyzing the information required to determine your process capability index. For expample: * Reflow oven: Fairly simple,
Electronics Forum | Tue Oct 31 10:23:34 EDT 2017 | khaled2017
Hi all, What is the best method &/Or equipment to test assembled Notebook for internal process mistake (shorts for example)
Electronics Forum | Thu Sep 10 20:46:05 EDT 2020 | SMTA-64387687
Has anyone had experience in applying OSP coating? How difficult is the process? And, what is the equipment used?
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