Electronics Forum | Fri Jul 14 16:35:03 EDT 2000 | Dave F
Celia: Ubet. Sorry about the ranting. (It comes with the territory.) I don�t recall any peer reviewed stuff, but I seem to remember a couple of articles on white tin in "SMT" "Circuits Assembly" Magazine (er suppin� like that), but it was probabl
Electronics Forum | Wed Feb 07 21:56:00 EST 2001 | davef
Every critter out there with large incisors adapted for gnawing and nibbling has a different theory of solder ball formation. [My theory: It�s punishment for using NC fluxes. Stand and deliver. My solder balls end-up in the gross filter connected
Electronics Forum | Thu Aug 23 20:51:15 EDT 2001 | davef
Every thing you need is in "links" here http://packaging.hp.com/. The only thing you need to do now is find it. Ah, so much information, so little time. Yeh yeh yeh, nice little ESD bags are good. Er, maybe sealed barrier bags might be better. E
Electronics Forum | Tue Apr 17 08:47:13 EDT 2007 | Brett
Oh no! Doom and gloom on the horizon! Why should I even try? Gawd, I've heard this sh@t all my life and ya know what? I went to school, got good grades, worked my ass off, landed a decent job, and still work for a low IQ, non-Chinese, non-Indian
Electronics Forum | Tue Aug 07 20:51:43 EDT 2001 | davef
Sowaza BIC? Ru the ball point pen people? Know no sites, like thet, but let�s see what we can do here. Wedabomb. First, rather than defining the controls your suppliers must use to produce your product, why not specify a DPMO rate er suppin like t
Electronics Forum | Sat Mar 30 17:27:45 EST 2002 | davef
You should not have glue "all over the place." Tou should not have glue on solderable surfaces. It sounds like you are stringing glue from one dispense location to the next. Search the fine SMTnet Archives [there might be something there]. Read a
Electronics Forum | Thu Oct 26 17:48:47 EDT 2000 | Dave F
In response to your questions: 1) Suggestions on substrate material FR-4 or something better? Most PBGA are on BT. That might good for you, also. 2) Are there design guidelines for wire bonding pattern on the substrate? Several things: 1 Doesn�t
Electronics Forum | Tue Oct 24 19:40:40 EDT 2000 | Dave F
From the SMTnet Library Terms & Definitions [er whatever they call it] � Emulsion. A material that suppliers build-up on a printing screen to block portions of the screen. The un-blocked (open) portion of the screen define the pattern for depositi
Electronics Forum | Wed Sep 13 12:08:02 EDT 2000 | Dave F
Charlie: I'm with Wolfgang ... The prime cause of your cracked solder joint on a surface mount part is mechanical stress. That�s about as specific as you�re gonna get. More information would be helpful. For instance: * Talk about the distribution
Electronics Forum | Thu Jun 22 12:40:40 EDT 2000 | Boca
Everybody's right! Two concerns are proper preheat for the flux and reduced thermal shock to surface mount components. The stupid er dumb thing is that these can be at odds with each other. The flux vendor usually specs topside temp before wave.