Industry News | 2008-09-08 03:46:39.0
Essemtec AG, a leading manufacturer of surface mount technology production equipment, announces that it has worked with leading suppliers of die bonders to develop a highly economical solution for the efficient placement of special components on film or flex boards, providing many benefits to the users.
Industry News | 2021-11-05 07:35:56.0
Acquisition lays groundwork for a breakthrough: Microchips placement as part of additively manufactured electronics solution
Industry News | 2017-02-21 15:59:49.0
Essemtec announces that it has been awarded a 2017 NPI Award in the category of Component Placement – Multifunction for its FOX2. The award was presented to the company during a Tuesday, Feb. 14, 2017 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO. This marks the 15th industry award that the Swiss manufacturer has received in recognition of its production systems for electronic assembly and packaging. The new FOX2 by Essemtec combines jetting of solder paste or glue and placement in a single machine. The new version is based on the original award-winning platform, which is the first machine in its class with linear motors and a mineral cast frame, providing excellent speed, stability, accuracy, and making it perfectly suited for use in small to medium production environments.
Industry News | 2020-04-23 11:07:52.0
Essemtec announces that its FOX2 smart-sized modular pick-and-place technology is expandable in any direction. The new FOX2 combines jetting/dispensing, 2.5D placement, electrical testing, inventory control and traceability in a single machine.
Industry News | 2020-10-29 08:09:43.0
Essemtec announces that it was awarded a 2020 Mexico Technology Award in the category of Dispensing for its new Archerfish. The award was announced during a Virtual Awards Ceremony on Monday, October 26, 2020.
Industry News | 2021-10-07 15:33:28.0
Essemtec will exhibit at the the SMTA International Exposition, scheduled to take place Nov. 3-4, 2021 at the Minneapolis Convention Center in Minneapolis, MN. The company will highlight its dispensing solution for both the electronics and medical industries in Booth #3520.
Industry News | 2008-03-25 22:39:45.0
Comment from Martin Ziehbrunner, CEO
Industry News | 2005-09-23 13:31:20.0
The SP200-AVC from ESSEMTEC is a new stencil printer for fully automatic SMT assembly lines. The unique trans-stencil vision system, the integrated stencil cleaner and the continuous squeegee pressure regulation provide highest precision and reliability. The printer is designed for quick setup and changeover.
Industry News | 2011-06-20 18:39:34.0
Two years ago, the Swiss company Essemtec AG entered the Brazilian market directly. By founding Essemtec Brazil in Sao Paulo, the Swiss family business invested in one of the worldwide leading future markets for electronics. Florian Schildein recently spoke with Patrick Greuter, Area Sales Manager of South America, and Roberto Cardozo, Managing Director Essemtec Brazil, about the development of the subsidiary and its prospects.
Industry News | 2013-08-27 19:40:03.0
Due to technical progress with LEDs, ever more luminous semiconductors are coming onto the market.
