Electronics Forum | Fri Jul 10 08:37:26 EDT 2009 | cyber_wolf
If they are under filled fids, take heavy duty two part epoxy and mix it with carbon powder from your copier. Use a razor blade to carefully trowel it in. We now use laser etched fids. They are much better.
Electronics Forum | Wed Dec 23 12:46:51 EST 2009 | stepheniii
Can you etch where you want to solder to? But you would need harsh chemicals to do that. The whole point of chrome is to not chemically react.
Electronics Forum | Fri Jan 08 21:34:44 EST 2010 | isd_jwendell
Not specific to QFP, but I had a run of poorly etched boards. I could see the short using 75X magnification with back lighting, but only some of the time. Nasty little shorts on ~25% of the boards that cost us a boat-load of cash.
Electronics Forum | Mon Mar 22 09:00:26 EDT 2010 | muarty
Laser etch? or Pick and Place a label with your PnP machines.
Electronics Forum | Mon Mar 22 11:02:38 EDT 2010 | mun4o
Hi, we put barcode label after reflow.There have all information about date and lot.Some of PCB manufactures can etch barcode or another information on the PCB. regards,
Electronics Forum | Mon Mar 22 14:54:40 EDT 2010 | davef
Look here: * http://www.jetec.com/PCBarticle.html * http://www.uidlaser.com/2d-matrix-etching.php We have no relationship, nor receive benefit from the companies referenced above.
Electronics Forum | Fri Sep 10 08:23:34 EDT 2010 | duso02
We have done it before prior to conformal coating a customer's populated board with parylene. They had us do a sample first then conducted testing. No ill effects but it really comes down to the components installed and what they can handle. The surf
Electronics Forum | Thu Jan 10 11:22:48 EST 2013 | pbarton
Looks to me like under etching of the underlying copper and the gold is just plated to all of the exposed copper surface. Is this characteristic the same on all solderable pads? You will not be able to remove this gold.
Electronics Forum | Tue Jan 15 10:35:08 EST 2013 | boriskilk
We would agree with Pete B about both the under etching as a possible issue and you will not be able to remove this gold. Another possibility is the solder mask (plating resist) hasn't been taken right to the edge of the pad.
Electronics Forum | Wed May 14 13:31:22 EDT 2014 | taiji
You should look in to this document: IPC/JEDEC-9704A Printed Circuit Assembly Strain Gage Test Guideline Regards
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