Electronics Forum | Thu Nov 17 20:19:00 EST 2022 | emeto
I need to back it up with a something like IPC standard. It seems to me that people have used boards that aged after the 12months period, however there is no information supported by studies that can show results in quality and reliability of the boa
Electronics Forum | Mon Jan 09 11:34:40 EST 2023 | tommy_magyar
How big is the board? What is the thickness? How populated is it? Is it warping in the reflow oven? If yes, does the oven have any support? How big is the pad compared to the component footprint? How thick is the stencil? Are the components checked b
Electronics Forum | Wed May 15 08:04:27 EDT 2024 | james2024
Hello, The fiber optics cable appears to be functioning correctly; transmission is evident through the blinking LEDs, and the computer can read the status of all transport sensors. I have managed to identify an error in the logs. Please use the foll
Electronics Forum | Wed Dec 02 16:35:21 EST 2020 | kylehunter
> Hi Kyle, As per IPC 610, for class 3, this is > not acceptable, as your minimum fillet height has > to be either one of these two, whichever is > less: - solder thickness + 25% of the termination > height - solder thickness + 0.
Electronics Forum | Thu Nov 09 03:19:40 EST 2000 | Chris May
Cristiano, Are your oxidised components now all on boards ? How many and how many terminations ? If you have any that are still to be used, maybe you can get the supplier / customer to replace them, unless of course they are well old. If you have
Electronics Forum | Fri Oct 27 15:22:08 EDT 2000 | Glenn Robertson
Chris - You are not the first to see this problem. I have seen a similar case on parts from another company. There may be a way to "clean" the parts but I'm not aware of it. Maybe someone else will have an idea. I suggest you ask Motorola h
Electronics Forum | Sat Sep 09 08:21:36 EDT 2000 | Sal
guys Currently experienced this problem on a product which had been running satifactorily for a period of time. No process changes were made, The problem was highlighted when after ICT when the boards were loaded in to the stress chamber, after the
Electronics Forum | Mon Sep 11 20:30:21 EDT 2000 | Dave F
Don�t kid yourself Sal, either: * Components were always falling off your board, but someone just noticed it ... OR * Something in your process HAS changed ... OR * Both Voids are primarily process indicators. I won't comment on the cause of the
Electronics Forum | Thu Aug 10 13:36:48 EDT 2000 | Bob Willis
I recently have been examining multilayer board failures. They are the classic inner connection failure between the foil and the through hole plating which I have not seen in many years. Has any one experienced any issues recently specifically relati
Electronics Forum | Thu Jul 12 10:45:42 EDT 2001 | Hussman
Since your customer is complaining, you'd better be pro-active. Doesn't mean they're right, but without customers, life sux alittle. Anyway, ask them for a profile of the 5 reflow processes. If they don't have that and you have a profiler, ask if
