Electronics Forum | Tue Nov 29 22:16:43 EST 2005 | ams_gen
Hello, Could any body direct me to guidelines describing the best practices for rework of perimeter array components (such at SOIC's and QFP's) or may be share your opinion of the best approach to do this? Thanx, AMS
Electronics Forum | Wed Feb 03 12:14:28 EST 1999 | mike
| who do you like to go to as a source of | caps, resistors, ICs, DIPs, connectors | | I'm looking for distributors. | | | smt and pth
Electronics Forum | Wed Nov 30 08:00:59 EST 2005 | davef
Look here: http://www.circuittechctr.com/guides/guides.shtml Also consider IPC-7711/7721: Rework and Repair Guide
Electronics Forum | Wed Jan 10 05:54:31 EST 2018 | tozitom
Thanks to all for your quick answers. I will do a prototype to test mechanical stability on USB-A, SMT version and will decide the next steps for there. Best Regards.
Electronics Forum | Wed Aug 06 20:50:42 EDT 2003 | davef
Well, if it "keeps coming up", let's take a pass at keeping down. For: * Requirement that gold be removed from components, pads, etc. is J-STD-001C, 5.4.1 * Context of that requirement [J-STD-001C, 5.4.1] and 6 or 7 references are in IPC-HDBK-001.
Electronics Forum | Tue Feb 15 13:47:59 EST 2000 | Stu Leech
We have just completed a test for a leading manufacturer of SMT IC packages. There were some surprises. The carrier and cover tapes appear to be highly hygoscopic. The saturation curves for the tape and devices showed dramatic absorption at the begin
Electronics Forum | Tue May 26 22:13:15 EDT 1998 | Pat Copeland
R&D is currently designing a board with smt components on both sides of the board. They are adding a 16 pin IC Gull wing. on the bottom side of the board. I have asked for only caps and resistors to be placed on the bottom side. Is there a recommende
Electronics Forum | Sun Jun 07 09:43:11 EDT 1998 | Bob Willis
There are some guidlines on design and through hole reflow on my web site to download. Also on pin in hole reflow the SMTA Office has a document on using the tecnology. | R&D is currently designing a board with smt components on both sides of the bo
Electronics Forum | Thu Aug 23 05:06:44 EDT 2018 | ringelgr
Hi, our company looks for a new smt mounter, we need a low-medium production machine with a real cph around 22000, the option of jedec tray and a range of component 0402-2010. Thanks to everyone in advance.
Electronics Forum | Fri May 06 08:47:05 EDT 2016 | davef
You're correct. This design will have a record amount of 0402 rework for tombstoning and misalignments. Suggest that the pads on each end of all components be the same size in order to balance wetting forces during reflow.
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