Electronics Forum | Wed Dec 02 16:35:21 EST 2020 | kylehunter
> Hi Kyle, As per IPC 610, for class 3, this is > not acceptable, as your minimum fillet height has > to be either one of these two, whichever is > less: - solder thickness + 25% of the termination > height - solder thickness + 0.
Electronics Forum | Thu Oct 26 12:36:02 EDT 2000 | Sal
Guys! witnessing a problem i've never seen before.Manufacturing a mixed technology with HASL finish, BGA,QFP's,fuses etc..etc. I've profiled the product, but what i'm witnessing is really weird. I've got a 0.020" QFP which is at the edge of the board
Electronics Forum | Wed Jun 12 11:26:50 EDT 2002 | pjc
Sean, Have you contacted Speedline Technologies applications enegineers? They have a lot of knowledge about SPOTT working with customers over the years to develop the process. I myself have experience doing SPOTT. I used Fuji GSP2 printers with overs
Electronics Forum | Wed Mar 21 20:40:28 EST 2001 | dblsixes
We are building a monster ... Dimensions are 10" x 7" ... 12 layers ... A Logic Assembly with a Power Supply all rolled into one ... The Power Supply is in one section of the board, the logic in the other section ... The Power Supply obviously has a
Electronics Forum | Fri Jun 12 14:22:53 EDT 1998 | Ryan Jennens
| Hey all! | The wave solder warrior is back. I have found a flux which leave almost no residue (the least yet), but because of its super low solids content I absolutely cannot get topside fillets. The multi-layer, two sided board is on a pall
Electronics Forum | Thu Jan 24 04:54:43 EST 2002 | wbu
Well Greg, I don�t know YOUR 0805 Pads but if you look at the recommended pattern for 0805 in IPC-SM-782 you might notice that the Z-dimension is somewhat about the size of your 1206 part length. With that and assuming that you ask if the results wi
Electronics Forum | Mon Dec 05 17:53:04 EST 2005 | KEN
I hate to sound like a broken record but the industry has been placing lead free through-hole parts forever. Now all of a sudden its a problem??? Gold finish, silver, silver paladium, alloy 42, even pure copper. Reliability will be a function of t
Electronics Forum | Tue Jan 23 14:26:12 EST 2007 | CL
Hello AR, Yes we are inspecting SMT that has been wave soldered. We are not inspecting solder on through hole components. We have actually found the solder inspector works better for wave solder SMT joints than reflowed. The system is great at ident
Electronics Forum | Mon Jul 31 03:50:26 EDT 2023 | calebcsmt
Is below the correct interpretation of IPC 610/JSTD requirements for FLAT LUG LEADS (seen on USBs and Diodes mainly) For class 1 or 2, no toe wetting would be required as minimum side joint is only 'evident wetting' and no actual length or fillet he
Electronics Forum | Thu Mar 22 15:44:50 EST 2001 | pteerink
I have a board with QFP240 plastic package exhibiting the same characteristics. Minimum heel fillet that doesn't change with stencil mods, paste change, profile change etc ( I am working to class 2, though, so my pass spec, although they are not pret
