Electronics Forum | Thu Jan 29 06:29:33 EST 2009 | sachu_70
There are two profiles available for the Pb-free process: (1) RSS and (2) RTS. In your case, you should try a solder paste that supports RTS profiles. A minimum of 7 zone Refow Oven would be fine on the Pb-free process. However, you may still try by
Electronics Forum | Thu Jan 29 11:30:56 EST 2009 | rgduval
As others have said, you'll have some difficulties getting good reflow on pb-free out of a 3-zone oven. We did it with a 4-zone for awhile, but only had really good success on low thermal density boards. That said, you should definitely check your
Electronics Forum | Thu Jan 29 16:51:57 EST 2009 | gregoryyork
Hi Small ovens work fine if the settings are correct and I seriously doubt 55cm/min is right. Profile it and speed down to around 35cm/min. Increase first zone to around 170 keep second at 208 but increase last to around 280 BUT profile to check it
Electronics Forum | Tue Apr 17 10:16:42 EDT 2001 | davef
Welcome to SMTnet. Awww, those assemblers are always whining about something. Just tell him to shut-up and build the blankin� boards. Jeesh!!! We used to have copious archives on the topic on SMTnet and our friend Brian is working his fingers t
Electronics Forum | Tue Aug 24 14:49:58 EDT 2004 | jamyboy
Hi, I am trying to assemble a LTCC component > with Pd/Ag surface finish on to Sn/Pb/Ag solder > and Sn/Ag/Cu solder. I am passing it through a > reflow. I have observed poor wettability at the > solder-pad joint. Does anyone have information
Electronics Forum | Tue Mar 15 09:46:06 EST 2005 | davef
Comments are: * J-STD-001 and A-610 committees have eliminated the requirement that solder joints be "bright and shiny". Certain metallizations (such as gold) can influence the solder joint surface texture, but have no impact of reliability. Reliance
Electronics Forum | Mon Feb 05 07:02:11 EST 2007 | CL
ASIR, Findings for us so far: OSP- has worked well for us for single sided boards only. We have seen problems with using it on double sided reflow applications. Also, some customers have specified OSP, but are intolerant of exposed copper. Limited
Electronics Forum | Fri Jan 30 06:28:42 EST 2009 | gregoryyork
Hi Armando Hotflow 7 is a big machine and one of the best Reflow ovens around (in my opinion), well suited for Lead Free. A typical 1.6mm board has the following settings for Lead Free SAC305 paste All Temperature settings are Top and Bottom Prehea
Electronics Forum | Mon Jun 15 16:31:25 EDT 2020 | rgduval
You may find some wetting issues running LF HASL with 63/37, as your reflow temperatures will be significantly below the LF reflow. On fiducials...if you don't have a quote for your boards with ENIG, I would recommend at least checking it out. It's
Electronics Forum | Fri Aug 13 16:54:20 EDT 2004 | davef
If the terminations on your components are not barrier plated, you must be very careful about the amount of time you stay above liquidous. As you'd expect, longer is not better. The longer you stay at liquidous, the more of the component terminatio
