Electronics Forum | Wed Apr 13 18:28:21 EDT 2005 | RT
We have a situation where our customer returned a device (BGA) with a missing solder ball. The process is Copper-Nickel-Gold-Solderball. EDX revealed that no trace of gold nor solder material (lead-free balls). Could poor Au plating/adhesion cause
Electronics Forum | Fri Jun 09 11:52:59 EDT 2006 | Rob
Yes you can solder on to it - just tried it with some 0603's across some gold fingers with tin lead paste & a heat gun. Don't know how many times you could rework it though. Any chance you could get hold of an aold populated board from your custome
Electronics Forum | Fri Jan 15 11:40:37 EST 1999 | Bob Willis
| | I am experiencing a problem with a surface mount coax connector that over time pulls loose from the PWB. The connector has 4 small gold plated leads and we are soldering it to a flash gold board. A cable plugs into the connector and puts some c
Electronics Forum | Tue Apr 13 08:08:33 EDT 1999 | Rob Palson
We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have to bu
Electronics Forum | Mon Apr 19 02:38:41 EDT 1999 | Brian Sloth Bentzen
| We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have to
Electronics Forum | Tue Apr 20 19:34:13 EDT 2004 | Ken
ImAg is the Surface finish of choice for Intel mother boards....Tin/lead and lead free processes. I think palladium and soft gold are the preferred for wire bondable apps.
Electronics Forum | Wed Jan 13 04:07:58 EST 2016 | crystalpcb
Hi Syed, I'm a PCB engineer from China. First:Immersion gold surface finish is the best for PCBs. Second:HASL(Lead-Free HASL) Then:HAL(with lead) The cheapest surface finish is OSP(After 15 days will be oxidized)
Electronics Forum | Sun Mar 31 10:03:25 EST 2002 | Bob
Cheers Dave, to answer some of your questions. � The component lead is copper with a tin / lead coating. The pads are standard Copper / Nickel / Gold. � The solder is standard Tin / Lead / Silver (2%) We have a lab that can determine the composition
Electronics Forum | Fri Nov 12 16:59:58 EST 1999 | John Thorup
Hi Michael While driving home last night I realized the omission in my response. I thought someone would call me on it. I should have clarified that the dissolution of the gold into the joint would be affected by the thickness of the gold plating,
Electronics Forum | Tue Oct 28 19:47:05 EDT 2008 | davef
Your gold might be a bit thin after you consider fabricator's tolerance. IPC-4552 ENIG specification: * Ni thickness: 3 - 6 microns [120 - 240 microinches]. * Au thickness: 0.075 - 0.125 microns [3 - 5 microinches]. * Recommended specification is
