Electronics Forum | Tue Nov 05 06:51:59 EST 2002 | V.RAMANAND KINI
Hi, This is a widely discussed subject and since you have asked a brief explanation, I assume, you are a business man or a top executive in the company venturing in to COB. I waited to see if someone replies to you. May be it is a very old subject
Electronics Forum | Wed Jul 26 10:06:19 EDT 2000 | Doug Philbrick
I have read many of the past threads on both topics and I still am not convinced I know the answer to the soldering problem we are encountering. I am hopping someone can help. I have a dense SMT board we are building and have been building for some
Electronics Forum | Fri Jan 15 11:40:37 EST 1999 | Bob Willis
| | I am experiencing a problem with a surface mount coax connector that over time pulls loose from the PWB. The connector has 4 small gold plated leads and we are soldering it to a flash gold board. A cable plugs into the connector and puts some c
Electronics Forum | Wed Apr 18 08:14:20 EDT 2007 | davef
Silver palladium termination * AgPd-terminated capacitors are designed for conductive adhesion. Reflow or wave soldering is not recommended. [EPCOS Multilayer ceramic capacitors, Soldering directions, October 2006] * CONDUCTIVE EPOXY BONDING. Epoxy c
Electronics Forum | Fri Nov 08 08:52:54 EST 2002 | dphilbrick
Juan There are many things that cause this and the first thing I would do is request quality records from your board fab facility on that particular lot. If they are unwilling to give them to you this is a good sign they had a processing problem. Th
Electronics Forum | Thu Oct 26 13:10:48 EDT 2000 | ptvianc
Yes, one should always be concerned about "field failures" because they represent the point at which the product has exceeded its design lifetime with respect to its service conditions. Hybrid microciruit technolgy (HMC) has been around for a long t
Electronics Forum | Mon Sep 11 14:15:28 EDT 2000 | Gary
I am looking for some details about the failure modes in popcorned components. Does the component usually fail to operate. Is the damage likely to extend to the gold bond, wires, or substrate. We have experienced a high failure rate on a subset of
Electronics Forum | Fri May 28 13:19:31 EDT 2021 | cbart
I can't see the image very well, but from what i see it looks like oxidation. looks like an ENIG finish on the board, possibly a plating issue from the bare board house, thin gold or the nickle is to thick. one other question i would get an answer t
Electronics Forum | Wed Aug 04 11:01:46 EDT 2010 | ooskii
I have a question concerning what plating will go into solution during the reflow process. I am soldering a small piece of ceramic (120x180 mils 7 mil thick) onto a flex circuit. I am seeing some fractures that I am sure are being caused by handlin
Electronics Forum | Wed Jun 17 14:46:18 EDT 1998 | Robert Smith
1. I need to be able to probe into my product's substrate which has all components in die form. I would need to be able to bring out any pad information for hookup to a scope or any other external piece of equipment. I do not have the convenience o
