Electronics Forum | Thu Aug 15 11:40:27 EDT 2002 | melo_guy
Hey chris, What state do you live in? I speak with engineers, and research companies all day long, its my job. I will keep you in mind when i see if they are hiring. I often check a companies employment opportunities to learn a little more about
Electronics Forum | Sat Aug 02 08:12:05 EDT 2003 | davef
Q: So, can I concluded that this greenish "fungus" looking staff is not initiated from high hot air temperature setting ? A: Your temperature setting could have increased the growth rate of this crunchy looking stuff, but we wouldn't start there to
Electronics Forum | Mon Oct 06 10:04:29 EDT 2003 | davef
Excess low residue flux is very dangerous to leave on your finished assembly, because it can: * Be corrosive to your solder connections * Promote dendrite growth. To prevent this, follow your supplier's recommendations on: * Applying the proper amou
Electronics Forum | Thu Oct 14 06:27:45 EDT 2004 | davef
a disturbed solder joint. * Extended/slow cool down ramps can result in surface texture => grainy solder joint. Second, the "BGA scaling" could be a reflection of: * Too little heat (incomplete solidification) OR * Too much heat (excess grain growt
Electronics Forum | Sun Nov 21 21:40:13 EST 2004 | John
I'm experiencing an impedance breakdown on an 0805 ceramic cap. In the application, the cap is at a 16V bias at all times. The unit failed in an extremely high humidity condition. We are using a NC flux and have determined there was flux underneat
Electronics Forum | Fri Jan 28 09:30:07 EST 2005 | reash
Well the powers that be actually want to go with a regular rework station, for future growth. I guess they plan on using BGAs sometime in the near future. We're also planning on using a D-Pak device in this first board. So now we're looking at the
Electronics Forum | Wed May 04 13:13:43 EDT 2005 | Jimmie
We have seen the black dot on the BGA pad after the component has been removed from a PCB. When most likely could this corrosion have occurred, while the component was in storage, during manufacturing of the unit? We have a number of these BGA's th
Electronics Forum | Tue Oct 11 14:42:15 EDT 2005 | patrickbruneel
NASA website on Tin whiskers: http://nepp.nasa.gov/whisker/ NEMI Tin whisker activities: http://www.inemi.org/cms/projects/ese/tin_whisker_activities.html CALCE Tin Whisker Working Group: http://www.calce.umd.edu/lead-free/tin-whiskers/ Measur
Electronics Forum | Thu Mar 08 22:35:13 EST 2007 | davef
Suggestions are: * Procure solderable finishes that have sufficient thickness to avoid intermetallic problems and use storage conditions that do not promote oxide growth problems. * Bagging/sealing boards has been shown to extend storage durations i
Electronics Forum | Thu Apr 19 05:48:17 EDT 2007 | Rob
Rick, That's surely a risk worth taking! On a more serious note, China has a population approximately 5 times that of the USA, and it is still in the growth phase of it's industrial revolution so naturally they will need a higher proportion of engi
