Electronics Forum: hal & smobc (Page 10 of 12)

ENIG again! Failed BGA joint!

Electronics Forum | Tue May 08 03:14:12 EDT 2001 | sinclair

We started our first ENIG process recently and to our surprise, we have many failure on the one and only BGA on the board. The BGA is a 31 mils pitch plastic. Sending the PCBA to 1 cycle of heating/cooling @ 70/-5 degree C yield 40% of failure. With

QFP Defect

Electronics Forum | Mon Jun 25 20:39:08 EDT 2001 | ianchan

Hi mate, no complete info given from what i see, so just some humble comments, mayhaps you review : 1) PCB pad finishing - Copper+nickle plated? coz if so, nickle is a KILLER to good solder wetting. what we did back here, was to HAL coat the nickle

Re: 2% silver solder paste

Electronics Forum | Mon Apr 19 02:45:31 EDT 1999 | Brian Sloth Bentzen

| | We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have t

Re: SOLDER BALL UNDER THE PCB AFTER REFLOW SOLDERING

Electronics Forum | Thu Oct 01 19:07:48 EDT 1998 | Paul R. Smith

Kyung Sam, Justin is correct, there is definately either a board design problem or the PCB maker issue. Obviously there are many mixed technology boards built in the world so I would lean towards a design issue as the root cause. Should you or you

Sn43Pb43Bi14 Solder

Electronics Forum | Tue Jul 16 21:53:51 EDT 2002 | davef

We don't use Sn43Pb43Bi14 solder. We don't make high performance circuit boards that are subjected to temperatures from -55� Celsius to +85� Celsius and vibration requirments at 6g. We don't like bismuth solder alloys, because: * Fatigue life is r

Backward compatibility in LF solder pot

Electronics Forum | Fri Jul 22 03:07:45 EDT 2005 | Joseph

Dear all, As we know there is a high risk of reliability issue due to lead contamination during mixture of NLF component at LF wave soldering process. But we have the following feed back from one of our customer as follow: Concerning the risk of m

Dross or Dark Green Mud Found in HAL machine

Electronics Forum | Sat Jul 02 10:27:19 EDT 2022 | madisreivik

Hello ! I got exp only with leadfree HASL, but maybe the same problems apply. Also, the leaded HASL has probably lower process temperature. This could be copper, which has settled to the tank bottom. With leadfree, the copper is removed from molten

Need advise on regarding Vias

Electronics Forum | Mon Dec 13 00:48:33 EST 1999 | armin

Hi All I have a 0.7 mm diameter hole for vias, what�s the minimum annular ring for this hole diameter? What�s the term unsupported and supported holes refer to in IPC-2221 9.1.2 Annular Ring Requirements? I have a proto-type PCB (designed by our R&

Re: Last question before I get my diploma

Electronics Forum | Mon Aug 24 09:07:03 EDT 1998 | Earl Moon

| What conditions make Earl Moon say "damn, why can't XXX get the HASL right? Just look at this crummy board. Get a RMA No. Stat." I don't have to get that frustrated because I deal with those who do it right most of the time. You have to consider th

Re: Last question before I get my diploma

Electronics Forum | Tue Aug 25 06:59:04 EDT 1998 | Flyin' on my own

Thanks for the great info, man!! | | What conditions make Earl Moon say "damn, why can't XXX get the HASL right? Just look at this crummy board. Get a RMA No. Stat." | I don't have to get that frustrated because I deal with those who do it right m


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